Journal of Electronic Packaging: Recent submissions
Now showing items 921-940 of 2123
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Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of Sn∕37Pb and Sn∕3Ag∕0.5Cu Solder Alloys
(The American Society of Mechanical Engineers (ASME), 2007)Time-dependent deformations such as creep and ratchetting of solder alloys are significant deformation phenomena that need to be understood to ensure the safety and reliability of solder joints ... -
Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards
(The American Society of Mechanical Engineers (ASME), 2007)A multidisciplinary placement optimization methodology for heat generating electronic components on printed circuit boards (PCBs) is presented. The methodology includes thermal, electrical, and ... -
Design Guideline for Ball Impact Test Apparatus
(The American Society of Mechanical Engineers (ASME), 2007)The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that ... -
Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface
(The American Society of Mechanical Engineers (ASME), 2007)Steady, laminar flow and heat transfer, inside a rectangular microchannel with a dimpled bottom surface, are numerically studied. The microchannel is 50×10−6m(50μm) deep and 200×10−6m(200μm) ... -
Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages
(The American Society of Mechanical Engineers (ASME), 2007)We present in this paper parametric studies of board-level reliability of wafer-level chip-scale packages subjected to a specific pulse-controlled drop test condition. Eighteen experiment cells, ... -
Effect of Test Conditions on Electromigration Reliability of Sn–Ag–Cu Flip-Chip Solder Interconnects
(The American Society of Mechanical Engineers (ASME), 2007)The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue ... -
Flip-Chip Underfill Packaging Considering Capillary Force, Pressure Difference, and Inertia Effects
(The American Society of Mechanical Engineers (ASME), 2007)This study aims to enhance the flow rate and reduce the filling time in flip-chip underfill packaging by combining capillary force, pressure difference, and inertia effects. In the designed ... -
Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5Sn–3.5Ag Solder Alloy Under Cyclic Multiaxial Straining
(The American Society of Mechanical Engineers (ASME), 2007)Based on the time dependent multiaxial deformation behavior of 96.5Sn–3.5Ag solder alloy, a constitutive model is proposed which considers the nonproportional multiaxial cyclic deformation properties. ... -
Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging
(The American Society of Mechanical Engineers (ASME), 2007)Interfacial failure under thermal cycling conditions is one of the main concerns in package design. To minimize such failure in multi-layered electronic assemblies and packages, it is important ... -
Electrical Properties of Polymers
(The American Society of Mechanical Engineers (ASME), 2007)Electrical Properties of Polymers,. Marcel-Dekker, Inc., New York, NY, 2004, 630 pp., $195.00, ISBN: 0-8247-5346-1 -
Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module
(The American Society of Mechanical Engineers (ASME), 2007)The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding ... -
Lead-Free Implementation and Production–A Manufacturing Guide
(The American Society of Mechanical Engineers (ASME), 2007)Lead-Free Implementation and Production–A Manufacturing Guide,. McGraw-Hill, New York, NY, 2005, 473 pp., $99.95, ISBN: 0-07-144374-6 -
Design Optimization and Reliability of PWB Level Electronic Package
(The American Society of Mechanical Engineers (ASME), 2007)As the electronic packaging industry develops technologies for fabrication of smaller, faster, economical and reliable products, thermal management and design play an important role. Temperature ... -
Shorter Field Life in Power Cycling for Organic Packages
(The American Society of Mechanical Engineers (ASME), 2007)The importance of power cycling as a mean of reliability assessment was revisited for flip chip plastic ball grid array (FC-PBGA) packages. Conventionally, reliability was addressed empirically ... -
An Investigation of Stresses Induced by Temperature Variation in Integrated Circuit Molding Process
(The American Society of Mechanical Engineers (ASME), 2007)A molding model is established in this study based on a real integrated circuit for simulating the molding process. This paper presents both the temperature distribution and the thermal stress ... -
Pressure Drop of Impingement Air Cooled Plate Fin Heat Sinks
(The American Society of Mechanical Engineers (ASME), 2007)The performance of impingement air cooled plate fin heat sinks differs significantly from that of parallel flow plate fin heat sinks. A simple impingement flow pressure drop model based on ... -
Modeling of Rotary Screw Fluid Dispensing Processes
(The American Society of Mechanical Engineers (ASME), 2007)Fluid dispensing is a process widely used in electronics packaging manufacturing, by which fluid materials are delivered in a controlled manner for the purpose of bonding, sealing, coating, or ... -
A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems
(The American Society of Mechanical Engineers (ASME), 2007)This paper presents a global–local methodology for predicting mechanical deformation and fatigue durability of solder joints in electronic packaging systems subject to cyclic thermal loading. It ... -
Inelastic Deformation and Fatigue of Solder Alloys Under Complicated Load Conditions
(The American Society of Mechanical Engineers (ASME), 2007)Fundamental study of deformation and fatigue fracture behavior of solder alloys under complex load conditions is a key to enabling implementation of sophisticated three-dimensional (3D) time-dependent ... -
Flow Structure and Enhanced Heat Transfer in Channel Flow With Dimpled Surfaces: Application to Heat Sinks in Microelectronic Cooling
(The American Society of Mechanical Engineers (ASME), 2007)The use of dimple technology for improvement in friction factors and enhancement of heat transfer has been attracting the attention of many scientists and engineers. Numerical and experimental ...