Journal of Electronic Packaging: Recent submissions
Now showing items 941-960 of 2123
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Cross-Verification of Thermal Characterization of a Microcooler
(The American Society of Mechanical Engineers (ASME), 2007)The thermal behavior of a microcooler has been investigated using two different measurement methods to verify their feasibility. On the one hand structure function derived from the thermal ... -
Air Cooling of Variable Array of Heated Modules in a Vertical Channel
(The American Society of Mechanical Engineers (ASME), 2007)The effect of array size and substrate thermal conditions upon heat transfer characteristics of an array of heated modules subjected to buoyancy assisted convection cooling in air is investigated. ... -
Efficient Cooling of Multiple Components in a Shielded Circuit Pack
(The American Society of Mechanical Engineers (ASME), 2007)We describe a technology in which multiple components inside a circuit pack shielded from electromagnetic interference (EMI) are efficiently cooled by individual heat sinks that protrude into an ... -
Interstitial Heat Transfer Coefficient and Dispersion Conductivity in Compressed Metal Foam Heat Sinks
(The American Society of Mechanical Engineers (ASME), 2007)This work experimentally and numerically investigates the heat transfer in uncompressed∕compressed metal foams. Experiments were conducted to obtain the thermal characteristics of a rectangular ... -
A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
(The American Society of Mechanical Engineers (ASME), 2007)The electronics industry, in recent years, has been focusing primarily on product miniaturization and lead-free assembly. The need for product miniaturization is due to the continuous demand for ... -
Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys
(The American Society of Mechanical Engineers (ASME), 2007)Strain gradient plasticity theories that have emerged during recent years to provide an explanation for size dependent behavior exhibited by some materials have also created a need for additional ... -
Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects
(The American Society of Mechanical Engineers (ASME), 2007)The disturbed state concept (DSC) with the hierarchical single surface (HISS) plasticity model have been proposed and validated previously for a wide range of problems in electronic packaging. ... -
Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber
(The American Society of Mechanical Engineers (ASME), 2007)This study examines the spreading ability of rectangular plates numerically, analytically, and experimentally. The effect of aspect ratio, defined as an equivalent radius of a heater divided by ... -
Lifetime Estimation of Moems Devices
(The American Society of Mechanical Engineers (ASME), 2007)Generally, microelectro mechanical systems (MOEMS) devices require encapsulation for protecting their fragile and tiny inner components in a hermetically sealed cavity. Cavity hermeticity can be ... -
Convective Cooling of a PCB Like Surface With Mixed Heating Conditions in a Vertical Channel
(The American Society of Mechanical Engineers (ASME), 2007)Printed circuit boards (PCBs) with uniform surface temperature and uniform wall heat flux are ideal to study. However, in reality, the heating conditions existing on the PCB surfaces are much ... -
Numerical Optimization of the Thermoelectric Cooling Devices
(The American Society of Mechanical Engineers (ASME), 2007)The present study proposes a unified numerical approach to the problem of optimum design of the thermoelectric devices for cooling electronic components. The standard mathematical model of a ... -
Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors
(The American Society of Mechanical Engineers (ASME), 2007)Microprocessor performance can be significantly improved by lowering the junction temperature, especially down to the deep subambient levels. This provides the strong motivation for the current ... -
Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals
(The American Society of Mechanical Engineers (ASME), 2007)Cracks have been observed in the insulating glass of bridge-wire initiators that may allow moisture to penetrate the assembly, potentially leading to the corrosion and degradation of the bridge ... -
Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS
(The American Society of Mechanical Engineers (ASME), 2007)Light emitting diodes (LEDs) historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors has ... -
Spray Cooling of IGBT Devices
(The American Society of Mechanical Engineers (ASME), 2007)The popularity and increased usage of insulated gate bipolar transistors (IGBTs) in power control systems have made the problem of cooling them a subject of considerable interest in recent ... -
A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results
(The American Society of Mechanical Engineers (ASME), 2007)The problem of heat removal in energetic processes represents a big challenge especially because of the enhanced requirements of the modern industry. The thermal exchange systems therefore have ... -
Simulations of Process-Induced Warpage During IC Encapsulation Process
(The American Society of Mechanical Engineers (ASME), 2007)Warpage during integrated circuit encapsulation process is a serious problem. Previous researchers had focused on warpage analysis with thermal-induced shrinkage and the cure-induced shrinkage was ... -
Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
(The American Society of Mechanical Engineers (ASME), 2007)The effect of process-induced voids on the durability of Sn–Pb and Pb-free solder interconnects in electronic products is not clearly understood. Experimental studies have provided conflicting ... -
Flexible Profile Compact Thermal Models for Practical Geometries
(The American Society of Mechanical Engineers (ASME), 2007)Recent advances in compact thermal models have led to the emergence of a new concept allowing models to be created at any desired order of accuracy. Traditionally, increasing precision was ... -
On-Wafer Capacitors Under Mechanical Stress
(The American Society of Mechanical Engineers (ASME), 2007)New packaging materials make it possible to produce flexible system in package (SIP) and system on package (SOP) modules. However, in these the integrated circuits are exposed to increased ...