Journal of Electronic Packaging: Recent submissions
Now showing items 961-980 of 2123
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Effect of RCC on the Reliability of Adhesive Flip Chip Joints
(The American Society of Mechanical Engineers (ASME), 2007)A need for higher packaging density and functionality has increased the use of new packaging technologies, which has also caused demand for higher interconnect densities on printed circuit boards ... -
Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
(The American Society of Mechanical Engineers (ASME), 2007)Dynamic properties of printed circuit board (PCB) assembly under drop impact are investigated when viscoelasticity of substrate materials is considered. The main materials of a PCB substrate are ... -
Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder
(The American Society of Mechanical Engineers (ASME), 2007)A series of multiaxial ratcheting tests were conducted on 63Sn–37Pb solder. A unified viscoplastic constitutive model was developed on the basis of the Ohno–Wang kinematic hardening model, and ... -
Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors
(The American Society of Mechanical Engineers (ASME), 2007)The recent introduction and advancements in design of simple, constant-force mechanisms have created the potential for small-scale, low-cost, constant-force electronic connectors (CFECs). CFECs differ ... -
Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader
(The American Society of Mechanical Engineers (ASME), 2007)Due to cost and process considerations, sometimes a drop-in heat spreader is incorporated in a quad flat package, which is not attached to the die pad. Consequently, due to mismatch of thermal ... -
Heat-Transfer Characteristics and Design Optimization for a Small-Sized Plate-Fin Heat Sink Array
(The American Society of Mechanical Engineers (ASME), 2007)The heat-transfer characteristics of 128 small-sized plate-fin heat sinks in a supercomputer chassis are investigated with CFD simulation. The V-shaped curves of the chip temperature versus fin ... -
Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
(The American Society of Mechanical Engineers (ASME), 2007)Fluid flow and heat transfer characteristics on and around a central pedestal and a secondary pedestal, mounted on a flat surface with an impinging jet, are investigated. Surface Nusselt numbers, ... -
An Experimental Approach for Thermal Characterization of Water-Cooled Heat Sinks Using Fourier Analysis Techniques
(The American Society of Mechanical Engineers (ASME), 2007)As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal ... -
Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink
(The American Society of Mechanical Engineers (ASME), 2007)With the rapid development of the Information Technology (IT) industry, the heat flux in integrated circuit (IC) chips cooled by air has almost reached its limit at about 100W∕cm2. Some ... -
Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages
(The American Society of Mechanical Engineers (ASME), 2007)There is considerable uncertainty in the prediction of performance of a system, due mainly to idealizations in geometry, material behavior, and loading history. Uncertainties in geometry can be ... -
Simultaneous Electrothermal Test Method for Pyroelectric Microsensors
(The American Society of Mechanical Engineers (ASME), 2007)Pyroelectric film materials, including polyvinylidene fluoride (PVDF) and its copolymers (e.g., P(VDF/trifluoroethylene)), are attractive candidates for low-cost infrared detection and imaging applications ... -
A Systematic Approach to Predicting Critical Heat Flux for Inclined Sprays
(The American Society of Mechanical Engineers (ASME), 2007)This study provides a new systematic approach to predicting the effects of spray inclination on critical heat flux (CHF). Experiments were performed with three pressure spray nozzles over a ... -
A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance
(The American Society of Mechanical Engineers (ASME), 2007)Demand for off-chip bandwidth has continued to increase. It is projected by the Semiconductor Industry Association in their International Technology Roadmap for Semiconductors that by the year ... -
Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints
(The American Society of Mechanical Engineers (ASME), 2007)Isothermal three-point and four-point cyclic bend fatigue test methods have been developed for Sn–Ag–Cu solder joints. Reported bend tests from the literature were conducted at room temperature ... -
High Thermal Conductive Si3N4 Particle Filled Epoxy Composites With a Novel Structure
(The American Society of Mechanical Engineers (ASME), 2007)Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that ... -
A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package
(The American Society of Mechanical Engineers (ASME), 2007)In this article, we present a theoretical study on the concept known as critical clearance for flip-chip packages. The critical clearance phenomenon was first observed in an experiment reported ... -
Experimental Study of Pressure Drop and Heat Transfer in a Single-Phase Micropin-Fin Heat Sink
(The American Society of Mechanical Engineers (ASME), 2007)The pressure drop and heat transfer characteristics of a single-phase micropin-fin heat sink were investigated experimentally. Fabricated from 110 copper, the heat sink contained an array of 1950 ... -
Thermal Management of a High Packing Density Array of Power Amplifiers Using Liquid Cooling
(The American Society of Mechanical Engineers (ASME), 2007)The increasing demand for smaller more compact electronic systems as well as the need to handle higher levels of power dissipation has lead to an increase in necessity for more innovative ... -
Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography
(The American Society of Mechanical Engineers (ASME), 2007)In high-density packaging technology, one of the most important issues is the reliability of the microjoints connecting large scale integrated circuit chips to printed circuit boards electrically ... -
On Moisture Diffusion Modeling Using Thermal-Moisture Analogy
(The American Society of Mechanical Engineers (ASME), 2007)Thermal-moisture analogy schemes for a moisture diffusion analysis are reviewed. Two schemes for practical applications are described using the governing equations of heat and mass diffusions: (1) ...