Journal of Electronic Packaging: Recent submissions
Now showing items 981-1000 of 2123
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Analytical and Experimental Characterization of Bonding Over Active Circuitry
(The American Society of Mechanical Engineers (ASME), 2007)Placing active circuitry directly underneath the bond pads is an effective way to reduce the die size, and hence to achieve lower cost per chip. The main concern with such design is the ... -
Heat Conduction in Multilayered Rectangular Domains
(The American Society of Mechanical Engineers (ASME), 2007)This paper presents the results of an analytical study of steady state heat conduction in multiple rectangular domains. Any finite number of domains that are equally sized (in plane) may be ... -
Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement
(The American Society of Mechanical Engineers (ASME), 2007)A series of experimental investigations on the studies related to fluid flow and transient mixed convection from a horizontally unconfined stationary or rotating ceramic-based multichip module ... -
An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls
(The American Society of Mechanical Engineers (ASME), 2007)Although accelerated thermal cycling has been widely used in electronics industry to qualify electronic packages, efforts to reduce the time and cost associated with such qualification techniques ... -
Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
(The American Society of Mechanical Engineers (ASME), 2007)An effective method for performing the thermal optimization of stationary and rotating multichip module (MCM) disks with an unconfined round-jet impingement under space limitation constraint has ... -
Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments
(The American Society of Mechanical Engineers (ASME), 2007)Increased use of sensors and controls in automotive applications has resulted in significant emphasis on the deployment of electronics directly mounted on the engine and transmission. Increased ... -
Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
(The American Society of Mechanical Engineers (ASME), 2007)Portable electronics is subjected to extreme accelerations in shock and drop impact. Product development cycle times and the cost constraints often restrict the number of design variations tested ... -
A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes
(The American Society of Mechanical Engineers (ASME), 2006)Power dissipation in electronic devices is projected to increase over the next 10years to the range of 150–250W per chip for high performance applications. One of the primary obstacles to the ... -
Cooling Performance of Using a Confined Slot Jet Impinging onto Heated Heat Sinks
(The American Society of Mechanical Engineers (ASME), 2006)A series of experimental investigations on the studies related to transient- and steady-state cooling performance from the horizontally heated heat sinks with a confined slot jet impingement have ... -
Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298]
(The American Society of Mechanical Engineers (ASME), 2006)Part (c) of Fig. 6 was inadvertently deleted from the final paper and is reproduced here. The on-line version of the paper has been revised. -
Implementation of Microchannel Evaporator for High-Heat-Flux Refrigeration Cooling Applications
(The American Society of Mechanical Engineers (ASME), 2006)While most recently electronic cooling studies have been focused on removing the heat from high-power-density devices, the present study also explores means of greatly decreasing the device ... -
Experimental and Computational Investigation of Flow Development and Pressure Drop in a Rectangular Micro-channel
(The American Society of Mechanical Engineers (ASME), 2006)Flow development and pressure drop were investigated both experimentally and computationally for adiabatic single-phase water flow in a single 222μm wide, 694μm deep, and 12cm long rectangular ... -
Models of Steady Heat Conduction in Multiple Cylindrical Domains
(The American Society of Mechanical Engineers (ASME), 2006)An analytical model of steady state heat conduction in multiple cylindrical domains is presented and discussed. The domains are axisymmetric, contiguous, and coaxial. Three domains are considered ... -
Modeling of Natural Convection in Electronic Enclosures
(The American Society of Mechanical Engineers (ASME), 2006)An analytical model is developed for natural convection from a single circuit board in a sealed electronic equipment enclosure. The circuit card is modeled as a vertical isothermal plate located ... -
Thermal Joint Resistance of Polymer-Metal Rough Interfaces
(The American Society of Mechanical Engineers (ASME), 2006)A compact analytical model is proposed for predicting thermal joint resistance of rough polymer-metal interfaces in a vacuum. The model assumes plastic deformation at microcontacts and joint ... -
“Heat Shield”—An Enhancement Device for an Unshrouded, Forced Convection Heat Sink
(The American Society of Mechanical Engineers (ASME), 2006)The inherent advantages of forced air cooling have led to the widespread use of fully and partially shrouded heat sinks for the thermal management of high power microprocessors. The superior ... -
Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus
(The American Society of Mechanical Engineers (ASME), 2006)A thermal interface material (TIM) is a crucial material for transferring heat from a die to a heatsink. We developed a new TIM composed of carbon nanotubes, silicon thermal grease, and ... -
An Experimental Study of the Enhancement of Air-Cooling Limits for Telecom/Datacom Heat Sink Applications Using an Impinging Air Jet
(The American Society of Mechanical Engineers (ASME), 2006)An experimental study was conducted to investigate the heat transfer from a parallel flat plate heat sink under a turbulent impinging air jet. A horizontal nozzle plate confined the target ... -
A Model for Flow Bypass and Tip Leakage in Pin Fin Heat Sinks
(The American Society of Mechanical Engineers (ASME), 2006)A model for the pressure drop and heat transfer behavior of heat sinks with top bypass is presented. In addition to the characteristics of a traditional two-branch bypass model, the physics ... -
Experimental Measurements of the Flow and Heat Transfer of a Square Jet Impinging on an Array of Square Pin Fins
(The American Society of Mechanical Engineers (ASME), 2006)The flow behavior and heat transfer due to free air jet impingement on pin fin heat sinks was experimentally studied. Flow velocities and tip clearance ratios were varied from 2to20m∕s and 0 ...