• Login
    View Item 
    •   DSpace Home
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   DSpace Home
    • ASME
    • Journal of Electronic Packaging
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

    Thumbnail
    View/Open
    JEPAE4-26280#411_1.pdf (973.8Kb)
    Date
    2007
    Author
    Y. C. Lee
    C. J. Fang
    M. C. Wu
    C. H. Peng
    Y. H. Hung
    Metadata
    Show full item record
    Abstract
    An effective method for performing the thermal optimization of stationary and rotating multichip module (MCM) disks with an unconfined round-jet impingement under space limitation constraint has been successfully developed. The design variables of stationary and rotating MCM disks with an unconfined round-jet impingement include the ratio of jet separation distance to nozzle diameter, Grashof number, jet Reynolds number, and rotational Reynolds number. The total experimental cases for stationary and rotating MCM disks are statistically designed by the central composite design method. In addition, a sensitivity analysis, the so-called analysis of variance, for the design factors has been performed. Among the influencing parameters, the jet Reynolds number dominates the thermal performance, while the Grashof number is found to have the least effect on heat-transfer performance for both stationary and rotating cases. Furthermore, the comparisons between the predictions by using the quadratic response surface methodology and the experimental data for both stationary and rotating cases are made with a satisfactory agreement. Finally, with the sequential quadratic programming technique, a series of thermal optimizations under multiconstraints—such as space, jet Reynolds number, rotational Reynolds number, nozzle exit velocity, disk rotational speed, and various power consumptions—has been systematically explored and discussed.
    URI
    http://yetl.yabesh.ir/yetl/handle/yetl/135524
    Collections
    • Journal of Electronic Packaging

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV
     

     

    Browse

    All of DSpaceCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

    My Account

    LoginRegister

    Statistics

    View Usage Statistics

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV