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dc.contributor.authorY. C. Lee
dc.contributor.authorC. J. Fang
dc.contributor.authorM. C. Wu
dc.contributor.authorC. H. Peng
dc.contributor.authorY. H. Hung
dc.date.accessioned2017-05-09T00:23:18Z
dc.date.available2017-05-09T00:23:18Z
dc.date.copyrightDecember, 2007
dc.date.issued2007
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26280#411_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/135524
dc.description.abstractAn effective method for performing the thermal optimization of stationary and rotating multichip module (MCM) disks with an unconfined round-jet impingement under space limitation constraint has been successfully developed. The design variables of stationary and rotating MCM disks with an unconfined round-jet impingement include the ratio of jet separation distance to nozzle diameter, Grashof number, jet Reynolds number, and rotational Reynolds number. The total experimental cases for stationary and rotating MCM disks are statistically designed by the central composite design method. In addition, a sensitivity analysis, the so-called analysis of variance, for the design factors has been performed. Among the influencing parameters, the jet Reynolds number dominates the thermal performance, while the Grashof number is found to have the least effect on heat-transfer performance for both stationary and rotating cases. Furthermore, the comparisons between the predictions by using the quadratic response surface methodology and the experimental data for both stationary and rotating cases are made with a satisfactory agreement. Finally, with the sequential quadratic programming technique, a series of thermal optimizations under multiconstraints—such as space, jet Reynolds number, rotational Reynolds number, nozzle exit velocity, disk rotational speed, and various power consumptions—has been systematically explored and discussed.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleHeat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
dc.typeJournal Paper
dc.journal.volume129
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2804089
dc.journal.fristpage411
dc.journal.lastpage420
dc.identifier.eissn1043-7398
dc.keywordsDesign
dc.keywordsOptimization
dc.keywordsDisks
dc.keywordsMulti-chip modules
dc.keywordsHeat transfer AND Reynolds number
dc.treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004
dc.contenttypeFulltext


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