Journal of Electronic Packaging: Recent submissions
Now showing items 1001-1020 of 2123
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A Practical Viscoplastic Damage Model for Lead-Free Solder
(The American Society of Mechanical Engineers (ASME), 2006)This paper summarizes the results of a program to construct an internal variable viscoplastic damage model to characterize 95.5Sn–3.9Ag–0.6Cu (wt.%) lead-free solder under cyclic thermomechanical ... -
Numerical Analysis of Blockage and Optimization of Heat Transfer Performance of Fractal-like Microchannel Nets
(The American Society of Mechanical Engineers (ASME), 2006)The conjugate fluid flow and heat transfer characteristics of fractal-like microchannel nets embedded in a disk-shape heat sink are investigated using a three-dimensional computational fluid dynamics ... -
An Experimental Investigation of a High Flux Heat Pipe Heat Sink
(The American Society of Mechanical Engineers (ASME), 2006)An experimental investigation of a highly efficient heat pipe heat sink was investigated, in which the interline region was optimized using sintered particles. The effects of condenser size, ... -
Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications
(The American Society of Mechanical Engineers (ASME), 2006)The nascent field of spintronics has great potential to enable new types of information processing and storage devices and supplement conventional semiconductor electronics. An overview of nanoscale ... -
Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices
(The American Society of Mechanical Engineers (ASME), 2006)Numerical simulations of time-dependent energy transport in semiconductor thin films are performed using the lattice Boltzmann method applied to phonon transport. The discrete lattice Boltzmann ... -
Investigation of Flow and Heat Transfer of an Impinging Jet in a Cross-Flow For Cooling of a Heated Cube
(The American Society of Mechanical Engineers (ASME), 2006)The current trends toward the greater functionality of electronic devices are resulting in a steady increase in the amount of heat dissipated from electronic components. Forced channel flow is ... -
Special Issue With Contributions From ITherm 2004
(The American Society of Mechanical Engineers (ASME), 2006)Since its inception 20 years ago, ITherm, The Intersociety Conference on Thermal, Mechanical, and Thermomechanical Phenomena in Electronic Systems, has been addressing recent advances in the area ... -
Thermal Phenomena in Nanoscale Transistors
(The American Society of Mechanical Engineers (ASME), 2006)As CMOS transistor gate lengths are scaled below 45nm, thermal device design is becoming an important part of microprocessor engineering. Decreasing dimensions lead to nanometer-scale hot spots ... -
Influence of the Fluid on the Experimental Performances of Triangular Silicon Microheat Pipes
(The American Society of Mechanical Engineers (ASME), 2006)An experimental study was conducted to determine the performances of silicon microheat pipes (MHPs) filled with different fluids. The MHP arrays are made of 27 triangular microchannels chemically ... -
Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems
(The American Society of Mechanical Engineers (ASME), 2006)One of the key challenges in the thermal management of electronic packages are interfaces, such as those between the chip and heat spreader and the interface between a heat spreader and heat ... -
Reliability of Lead-Free Solder Joints
(The American Society of Mechanical Engineers (ASME), 2006)Reliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the ... -
Viability of Dynamic Cooling Control in a Data Center Environment
(The American Society of Mechanical Engineers (ASME), 2006)Data center thermal management challenges have been steadily increasing over the past few years due to rack level power density increases resulting from system level compaction. These challenges ... -
Boiling Heat Transfer Enhancement Using a Submerged, Vibration-Induced Jet
(The American Society of Mechanical Engineers (ASME), 2006)In this paper we describe a new two-phase cooling cell based on channel boiling and a vibration-induced liquid jet whose collective purpose is to delay the onset of critical heat flux by ... -
Rapid Thermal Characterization of the High Thermal Conductivity Film Layers by the Film-on Substrate Technique
(The American Society of Mechanical Engineers (ASME), 2006)Lack of an efficient thermal management strategy and system can often lead to overall system failure in advanced microprocessors. This can be avoided by utilization of the high thermal conductivity ... -
A Three-Dimensional Solder Shape Model Incorporating Top Pad Inclination and Misalignment
(The American Society of Mechanical Engineers (ASME), 2006)In this technical brief, we describe a simple, yet versatile solder shape prediction model that can handle inclination (as is likely to occur when warped substrates are used) and misalignment ... -
Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection
(The American Society of Mechanical Engineers (ASME), 2006)In this paper, we present our recent experimental results on buoyancy-induced convection in aluminum metal foams of different pore densities [corresponding to 5, 10, 20, and 40 pores per in. ... -
Laminar Heat Transfer in Constructal Microchannel Networks With Loops
(The American Society of Mechanical Engineers (ASME), 2006)Heat sinks with radial and constructal branching microchannel networks with loops are examined numerically. Radial and constructal networks are embedded in disk-shaped heat sinks. Constructal nets ... -
Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions
(The American Society of Mechanical Engineers (ASME), 2006)In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient ... -
Heat Sinks With Enhanced Heat Transfer Capability for Electronic Cooling Applications
(The American Society of Mechanical Engineers (ASME), 2006)In a competition at Carnegie Mellon University, the mechanical engineering students designed and manufactured 27 heat sinks. The heat sinks were then tested for thermal performance in cooling a ... -
Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling
(The American Society of Mechanical Engineers (ASME), 2006)Understanding the thermal performance of power modules under liquid nitrogen cooling is important for the design of cryogenic power electronic systems. When the power device is conducting electrical ...