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    Reliability of Lead-Free Solder Joints

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    JEPAE4-26264#297_1.pdf (347.2Kb)
    Date
    2006
    Author
    John H. Lau
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    Abstract
    Reliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the lead-free solder joint reliability. Solder is the electrical and mechanical “glue” of electronics assemblies. Will lead-free solders provide the characteristics necessary to allow the world to depend on it in the future? This paper cannot answer this question; however, it will help all participants in the soldering world better understand what needs to be done in order to answer this question and plan for the future.
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    http://yetl.yabesh.ir/yetl/handle/yetl/133536
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