Reliability of Lead-Free Solder Joints

dc.contributor.author	John H. Lau
dc.date.accessioned	2017-05-09T00:19:36Z
dc.date.available	2017-05-09T00:19:36Z
dc.date.copyright	September, 2006
dc.date.issued	2006
dc.identifier.issn	1528-9044
dc.identifier.other	JEPAE4-26264#297_1.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/133536
dc.description.abstract	Reliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the lead-free solder joint reliability. Solder is the electrical and mechanical “glue” of electronics assemblies. Will lead-free solders provide the characteristics necessary to allow the world to depend on it in the future? This paper cannot answer this question; however, it will help all participants in the soldering world better understand what needs to be done in order to answer this question and plan for the future.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Reliability of Lead-Free Solder Joints
dc.type	Journal Paper
dc.journal.volume	128
dc.journal.issue	3
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.2229234
dc.journal.fristpage	297
dc.journal.lastpage	301
dc.identifier.eissn	1043-7398
dc.keywords	Reliability
dc.keywords	Lead-free solders
dc.keywords	Solder joints AND Solders
dc.tree	Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 003
dc.contenttype	Fulltext