Journal of Electronic Packaging: Recent submissions
Now showing items 1021-1040 of 2123
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The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition
(The American Society of Mechanical Engineers (ASME), 2006)This paper reports the effects of a multiple zincation process on the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the ... -
Heightened Thermal Convection as a Result of Splitting a Square Cavity Diagonally in Half
(The American Society of Mechanical Engineers (ASME), 2006)This investigation addresses the thermogeometric performance of a two-square cavity system contrasted against a two-isosceles triangular cavity system, with an exactly equal heating segment and ... -
Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules
(The American Society of Mechanical Engineers (ASME), 2006)In this paper we describe the materials-related challenges in applying folded flex packaging technology to wireless sensor networks and propose solutions for implementing miniaturized 5mm cube ... -
Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability
(The American Society of Mechanical Engineers (ASME), 2006)Power device packages with solder-bump (SB) and direct-solder (DS) interconnections were fabricated and some of their thermomechanical reliability issues were discussed based on both thermal cycling ... -
Study of Flow and Heat Transfer Characteristics in Asymmetrically Heated Sintered Porous Heat Sinks With Periodical Baffles
(The American Society of Mechanical Engineers (ASME), 2006)This work numerically examined the mechanism of heat transfer in a sintered porous heat sink with baffles. A channel filled with the sintered porous heat sink was asymmetrically heated and ... -
Electronics Packaging Cooling: Technologies From Gas Turbine Engine Cooling
(The American Society of Mechanical Engineers (ASME), 2006)Heat transfer in turbomachinery has been well established due to the long history of research in the field. A vast amount of research has been devoted to obtain flow fields and regimes, heat ... -
A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage
(The American Society of Mechanical Engineers (ASME), 2006)Our goals in this paper are to develop and demonstrate a computationally efficient methodology for assessing the effect of circuit board warpage, component warpage, and solder volume variation ... -
Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) Standards
(The American Society of Mechanical Engineers (ASME), 2006)The effects of altitude, increased ambient temperature, and increased relative humidity on the board level forced convection typical of telecommunications products were systematically examined through ... -
A Graphite Foams Based Vapor Chamber for Chip Heat Spreading
(The American Society of Mechanical Engineers (ASME), 2006)A vapor chamber using high thermal conductivity and permeability graphite foam as a wick has been designed, built, and tested. With ethanol as the working fluid, the vapor chamber has been ... -
Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies
(The American Society of Mechanical Engineers (ASME), 2006)One of the primary advantages of surface mount technology (SMT) over through-hole technology is that SMT allows the assembly of components on both sides of the printed circuit board (PCB). ... -
Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment
(The American Society of Mechanical Engineers (ASME), 2006)The design of cooling systems for electronic equipment is getting more involved and challenging due to increase in demand for faster and more reliable electronic systems. Therefore, robust and ... -
Singulation of Electronic Packages With Abrasive Waterjets
(The American Society of Mechanical Engineers (ASME), 2006)Abrasive waterjets (AWJ) were used for the first time to commercially singulate electronic chips such as those used for flash memory cards found in digital cameras, cell phones, and universal ... -
Graphite Foam Thermal Management of a High Packing Density Array of Power Amplifiers
(The American Society of Mechanical Engineers (ASME), 2006)Much focus has been placed on the thermal management of electronics in recent years. An overall reduction in size of electronic components as well as advances in chip technology, leading to ... -
An Evaluation of Gold and Copper Wire Bonds on Shear and Pull Testing
(The American Society of Mechanical Engineers (ASME), 2006)In microelectronic packaging technology wire bonding is a common interconnect technique. The quality and reliability of wire bonds are generally evaluated by ball shear and stitch pull testing. ... -
Experimental Study of Void Formation in Eutectic and Lead-Free Solder Bumps of Flip-Chip Assemblies
(The American Society of Mechanical Engineers (ASME), 2006)This paper reports the experimental findings of void formation in eutectic and lead-free solder joints of flip-chip assemblies. A previous theory indicated that the formation of voids is determined ... -
Constructal Peripheral Cooling of a Rectangular Heat-Generating Area
(The American Society of Mechanical Engineers (ASME), 2006)The present paper determines numerically the optimal geometric parameters for the maximal peripheral cooling of a two-dimensional rectangular solid body with internal heat generation. The objective ... -
Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components
(The American Society of Mechanical Engineers (ASME), 2006)In the design of printed circuit boards (PCBs), it is preferable to increase their fundamental frequency so as to reduce the effects of the dynamic loading on them. The dynamic characteristics ... -
Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
(The American Society of Mechanical Engineers (ASME), 2006)Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we ... -
Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials
(The American Society of Mechanical Engineers (ASME), 2006)No-flow underfill materials reduce assembly processing steps and can potentially be used in fine-pitch flip chip on organic board assemblies. Such no-flow underfills, when filled with nano-scale ... -
Test Methods for Silicon Die Strength
(The American Society of Mechanical Engineers (ASME), 2006)Recently, the 3D or stacked-die packages become increasingly popular for packaging ICs into a system or subsystem to satisfy the needs of low cost, small form factor, and high performance. For ...