Journal of Electronic Packaging: Recent submissions
Now showing items 1041-1060 of 2123
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Experimental Investigation of Heat Transfer in Impingement Air Cooled Plate Fin Heat Sinks
(The American Society of Mechanical Engineers (ASME), 2006)Impingement cooling of plate fin heat sinks is examined. Experimental measurements of thermal performance were performed with four heat sinks of various impingement inlet widths, fin spacings, ... -
Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board
(The American Society of Mechanical Engineers (ASME), 2006)This paper presents an analysis of an unexpected failure during vibration and shock life test of an electronic circuit board that has been in use for more than 15 years. During testing, an ... -
Cooling of Power Electronics by Embedded Solids
(The American Society of Mechanical Engineers (ASME), 2006)Thermal issues have become a major consideration in the design and development of electronic components. In power electronics, thermal limitations have been identified as a barrier to future ... -
Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink
(The American Society of Mechanical Engineers (ASME), 2006)The effects of dissolved air in the dielectric liquid FC-77 on flow boiling in a microchannel heat sink containing ten parallel channels, each 500μm wide and 2.5mm deep, were experimentally ... -
Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards
(The American Society of Mechanical Engineers (ASME), 2006)The active cooling substrate in this study is a microelectromechanical system device that implements the synthetic jet concept into a printed wiring board (PWB) to enhance thermal management. ... -
Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology
(The American Society of Mechanical Engineers (ASME), 2006)An accurate and efficient analytical geometric method is presented for predicting the geometric parameters of the controlled collapse chip connection type solder joint using direct chip attach ... -
Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders
(The American Society of Mechanical Engineers (ASME), 2006)Thermal characteristics for a horizontal heated chip mounted with three types of nominally flat silicon-based heat spreaders have been systematically investigated. They include the natural convective ... -
An Exergy-Based Figure-of-Merit for Electronic Packages
(The American Society of Mechanical Engineers (ASME), 2006)Chip power consumption and heat dissipation have become important design issues because of increased energy costs and thermal management limitations. As a global compute utility evolves, seamless ... -
The Exergy Cost of Information Processing: A Comparison of Computer-Based Technologies and Biological Systems
(The American Society of Mechanical Engineers (ASME), 2006)Processing information (analysis, storing, retrieving, sharing) is the primary function of modern computer-based information systems. Systems of this type generally require an input flow of exergy ... -
Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature
(The American Society of Mechanical Engineers (ASME), 2006)In a typical raised floor data center with alternating hot and cold aisles, air enters the front of each rack over the entire height of the rack. Since the heat loads of data processing ... -
The Role of Fin Geometry in Heat Sink Performance
(The American Society of Mechanical Engineers (ASME), 2006)The following study will examine the effect on overall thermal/fluid performance associated with different fin geometries, including, rectangular plate fins as well as square, circular, and ... -
A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages
(The American Society of Mechanical Engineers (ASME), 2006)This paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages ... -
Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material
(The American Society of Mechanical Engineers (ASME), 2006)Wax (predominantly tricosane paraffin wax, with a melting temperature of 48°C) filled with hexagonal boron nitride (BN) particles (5–11μm) was found to be an effective phase-change thermal ... -
Optimization Study for a Parallel Plate Impingement Heat Sink
(The American Society of Mechanical Engineers (ASME), 2006)A previous study by the authors on fin-shape optimization of a plate fin heat sink has concluded that a depopulated central zone, just under the center of the fan, provides a better thermal ... -
Thermal Design and Optimization Methodology for Integrated Power Electronics Modules
(The American Society of Mechanical Engineers (ASME), 2005)A methodology was developed and implemented to optimize the design layout for i_ntegrated p_ower e_lectronics m_odules (IPEMs) by considering both the electrical and thermal performances. This ... -
An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature
(The American Society of Mechanical Engineers (ASME), 2005)The flow modeling approaches employed in computational fluid dynamics (CFD) codes dedicated to the thermal analysis of electronic equipment are generally not specific for the analysis of forced ... -
Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions
(The American Society of Mechanical Engineers (ASME), 2005)Generally, adhesive materials can be cured in a short time under high curing temperature. High curing temperature usually leads to an increase in cross-link density and a homologous increase ... -
Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate
(The American Society of Mechanical Engineers (ASME), 2005)There has been steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low processing temperature and ... -
Adhesive Joining Process and Joint Property With Low Melting Point Filler
(The American Society of Mechanical Engineers (ASME), 2005)In order to conquer the limitation of conventional solders and adhesives used in electronics packaging, a novel self-organized joining process using conductive adhesive with low melting point ... -
Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers
(The American Society of Mechanical Engineers (ASME), 2005)This paper presents an assessment of four die-strength testing configurations using finite element analysis. The simulation indicates that ring-on-ring configuration is the best because it generates ...