Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers

Abstract

This paper presents an assessment of four die-strength testing configurations using finite element analysis. The simulation indicates that ring-on-ring configuration is the best because it generates a uniform stress field on a large die surface area. The four-point-bend configuration ranks second and the three-point-bend configuration is third. The pin-on-ring configuration is the worst because the stress gradient is severe in the central region. To minimize uncertainty in the loading positions, it is advised that loading rings or bars with small radii be used.