• Login
    View Item 
    •   DSpace Home
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   DSpace Home
    • ASME
    • Journal of Electronic Packaging
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

    Thumbnail
    View/Open
    JEPAE4-26266#380_1.pdf (1.294Mb)
    Date
    2006
    Author
    Siddharth Bhopte
    Dereje Agonafer
    Roger Schmidt
    Bahgat Sammakia
    Metadata
    Show full item record
    Abstract
    In a typical raised floor data center with alternating hot and cold aisles, air enters the front of each rack over the entire height of the rack. Since the heat loads of data processing equipment continue to increase at a rapid rate, it is a challenge to maintain the temperature of all the racks within the stated requirement. A facility manager has discretion in deciding the data center room layout, but a wrong decision will eventually lead to equipment failure. There are many complex decisions to be made early in the design as the data center evolves. Challenges occur such as optimizing the raised floor plenum, floor tile placement, minimizing the data center local hot spots, etc. These adjustments in configuration affect rack inlet air temperatures, which is one of the important keys to effective thermal management. In this paper, a raised floor data center with 12kW racks is considered. There are four rows of racks with alternating hot and cold aisle arrangement. Each row has six racks installed. Two air-conditioning units supply chilled air to the data center through the pressurized plenum. Effect of plenum depth, floor tile placement, and ceiling height on the rack inlet air temperature is discussed. Plots will be presented over the defined range. A multivariable approach to optimize data center room layout to minimize the rack inlet air temperature is proposed. Significant improvement over the initial model is shown by using a multivariable design optimization approach.
    URI
    http://yetl.yabesh.ir/yetl/handle/yetl/133502
    Collections
    • Journal of Electronic Packaging

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV
     

     

    Browse

    All of DSpaceCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

    My Account

    LoginRegister

    Statistics

    View Usage Statistics

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV