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dc.contributor.authorSiddharth Bhopte
dc.contributor.authorDereje Agonafer
dc.contributor.authorRoger Schmidt
dc.contributor.authorBahgat Sammakia
dc.date.accessioned2017-05-09T00:19:32Z
dc.date.available2017-05-09T00:19:32Z
dc.date.copyrightDecember, 2006
dc.date.issued2006
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26266#380_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/133502
dc.description.abstractIn a typical raised floor data center with alternating hot and cold aisles, air enters the front of each rack over the entire height of the rack. Since the heat loads of data processing equipment continue to increase at a rapid rate, it is a challenge to maintain the temperature of all the racks within the stated requirement. A facility manager has discretion in deciding the data center room layout, but a wrong decision will eventually lead to equipment failure. There are many complex decisions to be made early in the design as the data center evolves. Challenges occur such as optimizing the raised floor plenum, floor tile placement, minimizing the data center local hot spots, etc. These adjustments in configuration affect rack inlet air temperatures, which is one of the important keys to effective thermal management. In this paper, a raised floor data center with 12kW racks is considered. There are four rows of racks with alternating hot and cold aisle arrangement. Each row has six racks installed. Two air-conditioning units supply chilled air to the data center through the pressurized plenum. Effect of plenum depth, floor tile placement, and ceiling height on the rack inlet air temperature is discussed. Plots will be presented over the defined range. A multivariable approach to optimize data center room layout to minimize the rack inlet air temperature is proposed. Significant improvement over the initial model is shown by using a multivariable design optimization approach.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleOptimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature
dc.typeJournal Paper
dc.journal.volume128
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.2356866
dc.journal.fristpage380
dc.journal.lastpage387
dc.identifier.eissn1043-7398
dc.keywordsTemperature
dc.keywordsCeilings
dc.keywordsOptimization
dc.keywordsData centers AND Design
dc.treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004
dc.contenttypeFulltext


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