Journal of Electronic Packaging: Recent submissions
Now showing items 1061-1080 of 2123
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A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing
(The American Society of Mechanical Engineers (ASME), 2005)One of the general trends in microelectronics packaging is the constant miniaturization of devices. This has led to the development of maximum miniaturization of components on Si level, i.e., ... -
Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film
(The American Society of Mechanical Engineers (ASME), 2005)The thermo-mechanical integration of polymer films requires a precise knowledge of material properties. Nanoindentation is a widely used testing method for the determination of material properties ... -
Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects
(The American Society of Mechanical Engineers (ASME), 2005)The paper presents a study on printed wiring board (PWB) warpage caused by the mechanical fastening of separable interconnects, known as land grid array (LGA) package assemblies. Out-of-plane ... -
Resin Self-Alignment Processes for Self-Assembly Systems
(The American Society of Mechanical Engineers (ASME), 2005)We have demonstrated the self-alignment processes using surface tension of the resin material for the self-assembly systems. It has been known that the surface tension of the resin material is ... -
PCR Microchip Array Based on Polymer Bonding Technique
(The American Society of Mechanical Engineers (ASME), 2005)A polymerase chain reaction (PCR) microchip array with a dimension of 21.3×17.5 mm2 has been fabricated by the silicon micromachining technique. The chip is composed of 192 rectangular ... -
Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications
(The American Society of Mechanical Engineers (ASME), 2005)This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile ... -
Optical Fiber Shifts and Shear Stains in V-Groove Arrays for Optical MEMS Packaging
(The American Society of Mechanical Engineers (ASME), 2005)The objective of this study is to investigate optical fiber shifts and shear stains in V-groove arrays for optical microelectromechanical system packaging, when the arrays are subjected to ... -
Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications
(The American Society of Mechanical Engineers (ASME), 2005)Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package ... -
Creep Prediction of a Printed Wiring Board For Separable Land Grid Array Connector
(The American Society of Mechanical Engineers (ASME), 2005)The paper presents a study of creep behavior of a printed wiring board caused by the mechanical fastening of separable connector, known as a land grid array. Time-temperature superposition ... -
Various Adhesives for Flip Chips
(The American Society of Mechanical Engineers (ASME), 2005)Flip chips using various adhesives were studied. The assembly yields using nonconductive adhesive and anisotropic conductive film investigated were 97% and 100%, respectively. A packaging process ... -
Design and Thermal Characteristics of a Synthetic Jet Ejector Heat Sink
(The American Society of Mechanical Engineers (ASME), 2005)The design and thermal performance of a synthetic-air-jet-based heat sink for high-power dissipation electronics is discussed. Each fin of a plate-fin heat sink is straddled by a pair of ... -
An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems
(The American Society of Mechanical Engineers (ASME), 2005)A microfluidic mixing device for microsystems with electroosmotic flow (EOF)-driven liquid pumping is proposed and examined experimentally and numerically. Microchannels with SiO2 or Al2O3 wall are ... -
Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins
(The American Society of Mechanical Engineers (ASME), 2005)Surface Nusselt numbers, pressure coefficients, and flow visualizations are presented which are measured as a turbulent jet, with a fully developed velocity profile, impinges on the cylindrical ... -
Yield Function for Solder Elastoviscoplastic Modeling
(The American Society of Mechanical Engineers (ASME), 2005)Field reliability extrapolations from accelerated tests necessitate simulation of a variety of material behaviors under general loading conditions. The Hierarchical Incremental Single Surface (HiSS) ... -
Hygrothermal Cracking Analysis of Plastic IC Package
(The American Society of Mechanical Engineers (ASME), 2005)The purposes of the paper are to consider the failure phenomenon by delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process ... -
Failure Modes of Flip Chip Solder Joints Under High Electric Current Density
(The American Society of Mechanical Engineers (ASME), 2005)The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused ... -
Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)
(The American Society of Mechanical Engineers (ASME), 2005)In many applications such as computers and telecommunications, the IC chip sizes are very big, the on-chip frequency and power dissipation are very high, and the number of chip I/Os is very ... -
Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing
(The American Society of Mechanical Engineers (ASME), 2005)This paper presents the reliability of anisotropic conductive film (ACF) joint tested under reflow soldering and environmental test effect. The ACF joint behaved differently under different reflow ... -
Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies
(The American Society of Mechanical Engineers (ASME), 2005)Understanding the formation of voids in solder joints is important for predicting the long-term reliability of solder interconnects. This paper reports experimental research on the formation of ... -
Submodeling Analysis for Path-Dependent Thermomechanical Problems
(The American Society of Mechanical Engineers (ASME), 2005)In a finite element analysis, when localized behavior of a large model is of particular concern, generally one would refine the mesh until it captures the local solution adequately. Submodeling ...