The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions

Abstract

Potted electronics are becoming more common in precision-guided artillery due to demands for increased structural-robustness. In field artillery applications, the potted electronics are inactive for most of their lifetime. Projectiles may be stored in a bunker without environmental (temperature and humidity) controls for up to 20 years. In contrast, the electronics for most commercial applications tend to be active for most of their lifetime and the operating environment is more predictable. This difference makes the thermal management task for the artillery application challenging. The ability to accurately analyze these designs requires the use of fully coupled thermal-stress transient-analysis with accurate material properties over the full temperature range. To highlight the thermal-stress transient effects, the potted configuration of a typical electronics assembly is analyzed. The thermal analysis indicates that significant stresses can develop in critical locations as a result of temperature cycles. The structural dynamic responses of unpotted and potted assemblies, subjected to gun-launch environments, are also compared. The results indicate that for the potted design, the dynamic response of the processor board is attenuated by the potting material.