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    Effective Constitutive Relations for Sintered Nano Copper Joints

    Source: Journal of Electronic Packaging:;2022:;volume( 145 ):;issue: 002::page 21010-1
    Author:
    Thekkut, Sanoop
    ,
    Sivasubramony, Rajesh Sharma
    ,
    Raj, Arun
    ,
    Kawana, Yuki
    ,
    Assiedu, Jones
    ,
    Mirpuri, Kabir
    ,
    Shahane, Ninad
    ,
    Thompson, Patrick
    ,
    Borgesen, Peter
    DOI: 10.1115/1.4056113
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Sintered copper nanoparticles are being considered as alternatives to solder and/or sintered silver in different applications. Like for the alternatives, the interpretation of accelerated fatigue test results does however require modeling, typically involving prediction of stresses and strains versus time and temperature based on constitutive relations. This poses a challenge as the inelastic deformation properties depend strongly on both the initial particles and details of the processing, i.e., unlike for solder general constitutive relations are not possible. This work provides a mechanistic description of the early transient creep of relevance in cycling, including effects of sintering parameters and subsequent oxidation. Inelastic deformation is dominated by diffusion, rather than dislocation motion. Generalized constitutive relations are provided to the extent that quantitative modeling of a specific structure only requires the measurement of a single creep curve for that.
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      Effective Constitutive Relations for Sintered Nano Copper Joints

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4291707
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    contributor authorThekkut, Sanoop
    contributor authorSivasubramony, Rajesh Sharma
    contributor authorRaj, Arun
    contributor authorKawana, Yuki
    contributor authorAssiedu, Jones
    contributor authorMirpuri, Kabir
    contributor authorShahane, Ninad
    contributor authorThompson, Patrick
    contributor authorBorgesen, Peter
    date accessioned2023-08-16T18:15:05Z
    date available2023-08-16T18:15:05Z
    date copyright11/11/2022 12:00:00 AM
    date issued2022
    identifier issn1043-7398
    identifier otherep_145_02_021010.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4291707
    description abstractSintered copper nanoparticles are being considered as alternatives to solder and/or sintered silver in different applications. Like for the alternatives, the interpretation of accelerated fatigue test results does however require modeling, typically involving prediction of stresses and strains versus time and temperature based on constitutive relations. This poses a challenge as the inelastic deformation properties depend strongly on both the initial particles and details of the processing, i.e., unlike for solder general constitutive relations are not possible. This work provides a mechanistic description of the early transient creep of relevance in cycling, including effects of sintering parameters and subsequent oxidation. Inelastic deformation is dominated by diffusion, rather than dislocation motion. Generalized constitutive relations are provided to the extent that quantitative modeling of a specific structure only requires the measurement of a single creep curve for that.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEffective Constitutive Relations for Sintered Nano Copper Joints
    typeJournal Paper
    journal volume145
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4056113
    journal fristpage21010-1
    journal lastpage21010-9
    page9
    treeJournal of Electronic Packaging:;2022:;volume( 145 ):;issue: 002
    contenttypeFulltext
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    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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