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contributor authorThekkut, Sanoop
contributor authorSivasubramony, Rajesh Sharma
contributor authorRaj, Arun
contributor authorKawana, Yuki
contributor authorAssiedu, Jones
contributor authorMirpuri, Kabir
contributor authorShahane, Ninad
contributor authorThompson, Patrick
contributor authorBorgesen, Peter
date accessioned2023-08-16T18:15:05Z
date available2023-08-16T18:15:05Z
date copyright11/11/2022 12:00:00 AM
date issued2022
identifier issn1043-7398
identifier otherep_145_02_021010.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4291707
description abstractSintered copper nanoparticles are being considered as alternatives to solder and/or sintered silver in different applications. Like for the alternatives, the interpretation of accelerated fatigue test results does however require modeling, typically involving prediction of stresses and strains versus time and temperature based on constitutive relations. This poses a challenge as the inelastic deformation properties depend strongly on both the initial particles and details of the processing, i.e., unlike for solder general constitutive relations are not possible. This work provides a mechanistic description of the early transient creep of relevance in cycling, including effects of sintering parameters and subsequent oxidation. Inelastic deformation is dominated by diffusion, rather than dislocation motion. Generalized constitutive relations are provided to the extent that quantitative modeling of a specific structure only requires the measurement of a single creep curve for that.
publisherThe American Society of Mechanical Engineers (ASME)
titleEffective Constitutive Relations for Sintered Nano Copper Joints
typeJournal Paper
journal volume145
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4056113
journal fristpage21010-1
journal lastpage21010-9
page9
treeJournal of Electronic Packaging:;2022:;volume( 145 ):;issue: 002
contenttypeFulltext


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