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    Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 002
    Author:
    Samet, David
    ,
    Trilochan Rambhatla, V. N. N.
    ,
    Sitaraman, Suresh K.
    DOI: 10.1115/1.4045706
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Experimentally characterized critical interfacial fracture energy is often written as an explicit trigonometric function of mode-mixity and is used to determine whether an interfacial crack will propagate or not under given loading conditions for an application. A different approach to assess whether an interfacial crack will propagate is to employ a failure locus consisting of the critical fracture energies corresponding to different fracture modes, represented by an implicit formulation. Such a failure locus can be linear, elliptical, among other shapes. As it is nearly impossible to obtain isolated GIc or GIIc values through experimentation, extrapolations are used to determine these two extreme values based on intermediate experimental data. However, the magnitude of these extreme values as well as the shape of the two forms of failure curves are at risk of being inconsistent should proper care not be taken. An example of such an inconsistency would be to use a trigonometric formulation to obtain the extreme values through extrapolation and then employ those values in simulation through an elliptical failure. In this work, we have employed a series of commonly used interfacial fracture energy measurement techniques over a range of mode-mixities for a metal/polymer interface to demonstrate the potential discrepancy in the two approaches and to underscore the need for a consistent approach in evaluating interfacial crack propagation.
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      Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4273253
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    contributor authorSamet, David
    contributor authorTrilochan Rambhatla, V. N. N.
    contributor authorSitaraman, Suresh K.
    date accessioned2022-02-04T14:14:29Z
    date available2022-02-04T14:14:29Z
    date copyright2020/02/03/
    date issued2020
    identifier issn1043-7398
    identifier otherep_142_02_021001.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4273253
    description abstractExperimentally characterized critical interfacial fracture energy is often written as an explicit trigonometric function of mode-mixity and is used to determine whether an interfacial crack will propagate or not under given loading conditions for an application. A different approach to assess whether an interfacial crack will propagate is to employ a failure locus consisting of the critical fracture energies corresponding to different fracture modes, represented by an implicit formulation. Such a failure locus can be linear, elliptical, among other shapes. As it is nearly impossible to obtain isolated GIc or GIIc values through experimentation, extrapolations are used to determine these two extreme values based on intermediate experimental data. However, the magnitude of these extreme values as well as the shape of the two forms of failure curves are at risk of being inconsistent should proper care not be taken. An example of such an inconsistency would be to use a trigonometric formulation to obtain the extreme values through extrapolation and then employ those values in simulation through an elliptical failure. In this work, we have employed a series of commonly used interfacial fracture energy measurement techniques over a range of mode-mixities for a metal/polymer interface to demonstrate the potential discrepancy in the two approaches and to underscore the need for a consistent approach in evaluating interfacial crack propagation.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleExamination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction
    typeJournal Paper
    journal volume142
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4045706
    page21001
    treeJournal of Electronic Packaging:;2020:;volume( 142 ):;issue: 002
    contenttypeFulltext
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