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contributor authorSamet, David
contributor authorTrilochan Rambhatla, V. N. N.
contributor authorSitaraman, Suresh K.
date accessioned2022-02-04T14:14:29Z
date available2022-02-04T14:14:29Z
date copyright2020/02/03/
date issued2020
identifier issn1043-7398
identifier otherep_142_02_021001.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4273253
description abstractExperimentally characterized critical interfacial fracture energy is often written as an explicit trigonometric function of mode-mixity and is used to determine whether an interfacial crack will propagate or not under given loading conditions for an application. A different approach to assess whether an interfacial crack will propagate is to employ a failure locus consisting of the critical fracture energies corresponding to different fracture modes, represented by an implicit formulation. Such a failure locus can be linear, elliptical, among other shapes. As it is nearly impossible to obtain isolated GIc or GIIc values through experimentation, extrapolations are used to determine these two extreme values based on intermediate experimental data. However, the magnitude of these extreme values as well as the shape of the two forms of failure curves are at risk of being inconsistent should proper care not be taken. An example of such an inconsistency would be to use a trigonometric formulation to obtain the extreme values through extrapolation and then employ those values in simulation through an elliptical failure. In this work, we have employed a series of commonly used interfacial fracture energy measurement techniques over a range of mode-mixities for a metal/polymer interface to demonstrate the potential discrepancy in the two approaches and to underscore the need for a consistent approach in evaluating interfacial crack propagation.
publisherThe American Society of Mechanical Engineers (ASME)
titleExamination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction
typeJournal Paper
journal volume142
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4045706
page21001
treeJournal of Electronic Packaging:;2020:;volume( 142 ):;issue: 002
contenttypeFulltext


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