YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Reliability Considerations for Oil Immersion-Cooled Data Centers

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 002::page 21007
    Author:
    Shah, Jimil M.
    ,
    Eiland, Richard
    ,
    Rajmane, Pavan
    ,
    Siddarth, Ashwin
    ,
    Agonafer, Dereje
    ,
    Mulay, Veerendra
    DOI: 10.1115/1.4042979
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: The improved efficiency of mineral oil may offer simplicity in facility design compared to traditional air cooling and provide a means for cost savings. Despite its improved cooling efficiency and cost savings, a mineral oil immersion cooling technique is still not widely implemented and original equipment manufacturers are reluctant to jeopardize sales of existing air-based cooling system equipment. Only compelling physics regarding thermal performance of direct immersion cooling is not enough for data center operators. Many uncertainties and concerns persist regarding the effects of mineral oil immersion cooling on the reliability of information technology (IT) equipment both at the component and chassis level. This paper is a first attempt at addressing this challenge by reviewing the changes in physical and chemical properties of IT equipment materials like polyvinyl chloride (PVC), printed circuit board (PCB), and capacitors and characterizes the interconnect reliability of materials. The changes in properties of a mineral oil like kinematic viscosity and dielectric strength are also cited as important factors and discussed briefly. The changes in mechanical properties like elasticity, hardness, swelling, and creep are being shown in the paper for thermoplastic materials. The chemical reaction between material and mineral oil as a function of time and temperature is also conferred. The literature gathered on the subject and quantifiable data gathered by the authors provide the primary basis for this research document.
    • Download: (3.245Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Reliability Considerations for Oil Immersion-Cooled Data Centers

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/4258603
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorShah, Jimil M.
    contributor authorEiland, Richard
    contributor authorRajmane, Pavan
    contributor authorSiddarth, Ashwin
    contributor authorAgonafer, Dereje
    contributor authorMulay, Veerendra
    date accessioned2019-09-18T09:04:46Z
    date available2019-09-18T09:04:46Z
    date copyright4/10/2019 12:00:00 AM
    date issued2019
    identifier issn1043-7398
    identifier otherep_141_02_021007.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4258603
    description abstractThe improved efficiency of mineral oil may offer simplicity in facility design compared to traditional air cooling and provide a means for cost savings. Despite its improved cooling efficiency and cost savings, a mineral oil immersion cooling technique is still not widely implemented and original equipment manufacturers are reluctant to jeopardize sales of existing air-based cooling system equipment. Only compelling physics regarding thermal performance of direct immersion cooling is not enough for data center operators. Many uncertainties and concerns persist regarding the effects of mineral oil immersion cooling on the reliability of information technology (IT) equipment both at the component and chassis level. This paper is a first attempt at addressing this challenge by reviewing the changes in physical and chemical properties of IT equipment materials like polyvinyl chloride (PVC), printed circuit board (PCB), and capacitors and characterizes the interconnect reliability of materials. The changes in properties of a mineral oil like kinematic viscosity and dielectric strength are also cited as important factors and discussed briefly. The changes in mechanical properties like elasticity, hardness, swelling, and creep are being shown in the paper for thermoplastic materials. The chemical reaction between material and mineral oil as a function of time and temperature is also conferred. The literature gathered on the subject and quantifiable data gathered by the authors provide the primary basis for this research document.
    publisherAmerican Society of Mechanical Engineers (ASME)
    titleReliability Considerations for Oil Immersion-Cooled Data Centers
    typeJournal Paper
    journal volume141
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4042979
    journal fristpage21007
    journal lastpage021007-9
    treeJournal of Electronic Packaging:;2019:;volume( 141 ):;issue: 002
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian