YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

    Source: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 004::page 40801
    Author:
    Broughton, Justin
    ,
    Smet, Vanessa
    ,
    Tummala, Rao R.
    ,
    Joshi, Yogendra K.
    DOI: 10.1115/1.4040828
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Due to its superior electrical and thermal characteristics, silicon carbide power modules will soon replace silicon modules to be mass-produced and implemented in all-electric and hybrid-electric vehicles (HEVs). Redesign of the power modules will be required to take full advantage of these newer devices. A particular area of interest is high-temperature power modules, as under-hood temperatures often exceed maximum silicon device temperatures. This review will examine thermal packaging options for standard Si power modules and various power modules in recent all-electric and HEVs. Then, thermal packaging options for die-attach, thermal interface materials (TIM), and liquid cooling are discussed for their feasibility in next-generation silicon carbide (SiC) power modules.
    • Download: (1.388Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/4254141
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorBroughton, Justin
    contributor authorSmet, Vanessa
    contributor authorTummala, Rao R.
    contributor authorJoshi, Yogendra K.
    date accessioned2019-02-28T11:14:09Z
    date available2019-02-28T11:14:09Z
    date copyright8/20/2018 12:00:00 AM
    date issued2018
    identifier issn1043-7398
    identifier otherep_140_04_040801.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4254141
    description abstractDue to its superior electrical and thermal characteristics, silicon carbide power modules will soon replace silicon modules to be mass-produced and implemented in all-electric and hybrid-electric vehicles (HEVs). Redesign of the power modules will be required to take full advantage of these newer devices. A particular area of interest is high-temperature power modules, as under-hood temperatures often exceed maximum silicon device temperatures. This review will examine thermal packaging options for standard Si power modules and various power modules in recent all-electric and HEVs. Then, thermal packaging options for die-attach, thermal interface materials (TIM), and liquid cooling are discussed for their feasibility in next-generation silicon carbide (SiC) power modules.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleReview of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
    typeJournal Paper
    journal volume140
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4040828
    journal fristpage40801
    journal lastpage040801-11
    treeJournal of Electronic Packaging:;2018:;volume( 140 ):;issue: 004
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian