| contributor author | Broughton, Justin | |
| contributor author | Smet, Vanessa | |
| contributor author | Tummala, Rao R. | |
| contributor author | Joshi, Yogendra K. | |
| date accessioned | 2019-02-28T11:14:09Z | |
| date available | 2019-02-28T11:14:09Z | |
| date copyright | 8/20/2018 12:00:00 AM | |
| date issued | 2018 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_140_04_040801.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4254141 | |
| description abstract | Due to its superior electrical and thermal characteristics, silicon carbide power modules will soon replace silicon modules to be mass-produced and implemented in all-electric and hybrid-electric vehicles (HEVs). Redesign of the power modules will be required to take full advantage of these newer devices. A particular area of interest is high-temperature power modules, as under-hood temperatures often exceed maximum silicon device temperatures. This review will examine thermal packaging options for standard Si power modules and various power modules in recent all-electric and HEVs. Then, thermal packaging options for die-attach, thermal interface materials (TIM), and liquid cooling are discussed for their feasibility in next-generation silicon carbide (SiC) power modules. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes | |
| type | Journal Paper | |
| journal volume | 140 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4040828 | |
| journal fristpage | 40801 | |
| journal lastpage | 040801-11 | |
| tree | Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 004 | |
| contenttype | Fulltext | |
