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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-4 of 4
Data Center Housing High Performance Supercomputer Cluster: Above Floor Thermal Measurements Compared To CFD Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: With the ever increasing heat dissipated by information technology (IT) equipment housed in data centers, it is becoming more important to project the changes that can occur in the data center ...
Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to the increase in computer rack equipment power in recent years, thermal management of data centers has become a challenging problem. Data center facilities with raised floor plenums are ...
Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a typical raised floor data center with alternating hot and cold aisles, air enters the front of each rack over the entire height of the rack. Since the heat loads of data processing ...
Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The increasingly ubiquitous nature of computer and internet usage in our society has driven advances in semiconductor technology, server packaging, and cluster level optimizations in the IT ...