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    Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002::page 21009
    Author:
    Madhusudan Iyengar
    ,
    Roger Schmidt
    DOI: 10.1115/1.3103952
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The increasingly ubiquitous nature of computer and internet usage in our society has driven advances in semiconductor technology, server packaging, and cluster level optimizations in the IT industry. Not surprisingly this has an impact on our societal infrastructure with respect to providing the requisite energy to fuel these power hungry machines. Cooling has been found to contribute about a third of the total data center energy consumption and is the focus of this study. In this paper we develop and present physics based models to allow the prediction of the energy consumption and heat transfer phenomenon in a data center. These models allow the estimation of the microprocessor junction and server inlet air temperatures for different flows and temperature conditions at various parts of the data center cooling infrastructure. For the case study example considered, the chiller energy use was the biggest fraction of about 41% and was also the most inefficient. The room air conditioning was the second largest energy component and was also the second most inefficient. A sensitivity analysis of plant and chiller energy efficiencies with chiller set point temperature and outdoor air conditions is also presented.
    keyword(s): Flow (Dynamics) , Heat , Temperature , Cooling , Data centers , Energy consumption , Industrial plants , Water , Coolants , Cooling towers , Stress AND Heat transfer ,
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      Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems

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    http://yetl.yabesh.ir/yetl1/handle/yetl/140308
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    contributor authorMadhusudan Iyengar
    contributor authorRoger Schmidt
    date accessioned2017-05-09T00:32:19Z
    date available2017-05-09T00:32:19Z
    date copyrightJune, 2009
    date issued2009
    identifier issn1528-9044
    identifier otherJEPAE4-26295#021009_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/140308
    description abstractThe increasingly ubiquitous nature of computer and internet usage in our society has driven advances in semiconductor technology, server packaging, and cluster level optimizations in the IT industry. Not surprisingly this has an impact on our societal infrastructure with respect to providing the requisite energy to fuel these power hungry machines. Cooling has been found to contribute about a third of the total data center energy consumption and is the focus of this study. In this paper we develop and present physics based models to allow the prediction of the energy consumption and heat transfer phenomenon in a data center. These models allow the estimation of the microprocessor junction and server inlet air temperatures for different flows and temperature conditions at various parts of the data center cooling infrastructure. For the case study example considered, the chiller energy use was the biggest fraction of about 41% and was also the most inefficient. The room air conditioning was the second largest energy component and was also the second most inefficient. A sensitivity analysis of plant and chiller energy efficiencies with chiller set point temperature and outdoor air conditions is also presented.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAnalytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems
    typeJournal Paper
    journal volume131
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3103952
    journal fristpage21009
    identifier eissn1043-7398
    keywordsFlow (Dynamics)
    keywordsHeat
    keywordsTemperature
    keywordsCooling
    keywordsData centers
    keywordsEnergy consumption
    keywordsIndustrial plants
    keywordsWater
    keywordsCoolants
    keywordsCooling towers
    keywordsStress AND Heat transfer
    treeJournal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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