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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-10 of 11
Handbook of Electronic Packaging Design
Publisher: The American Society of Mechanical Engineers (ASME)
Approximating the Steiner Tree in the Placement Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: By simulating the movement of a node in a tree, an iso-distance error graph (IDEG) which contains connection errors generated by replacing a Steiner tree with its equivalent non-Steiner tree ...
A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wire bond connections are susceptible to fatigue failure as a result of various thermo-mechanical damage mechanisms during the component operation life. Because of uncertainties arising from the ...
Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Environmental Scanning Electron Microscopy (E-SEM) is a technique which provides the capability to investigate surface morphologies over a variety of controllable environmental conditions. This paper ...
Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents an analysis of an unexpected failure during vibration and shock life test of an electronic circuit board that has been in use for more than 15 years. During testing, an ...
Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO3 Composite Dielectric
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Accelerated temperature and voltage stress tests were conducted on embedded planar capacitors with epoxy–BaTiO3 composite dielectric. The failure modes were found to be a sudden increase in the ...
Temperature Dependence of the Mechanical Properties of GaAs Wafers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: GaAs is known to have superior electronic properties and greater photovoltaic conversion efficiency compared to elemental semiconductors such as silicon and germaniumn. Mechanical properties of ...
A Zonal Decomposition Methodology for Detailed Temperature Field Evaluation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A zonal decomposition technique is developed for temperature field and flux determination at both aligned and nonaligned grid interface boundaries. The method facilitates heat transfer problems ...
Product Reliability, Maintainability, and Supportability Handbook
Publisher: The American Society of Mechanical Engineers (ASME)