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    A Zonal Decomposition Methodology for Detailed Temperature Field Evaluation

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 003::page 260
    Author:
    Cha-Hsiang Tan
    ,
    Michael Pecht
    DOI: 10.1115/1.2904376
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A zonal decomposition technique is developed for temperature field and flux determination at both aligned and nonaligned grid interface boundaries. The method facilitates heat transfer problems commonly encountered in electronics including PWBs with multiple irregular boundaries in which numerical generation of boundary-fitted coordinates is required. To demonstrate the applicability and performance of the method, a 2-D heat conduction problem in Cartesian coordinates, a 2-D heat conduction problem in curvilinear coordinates, and a 3-D heat conduction problem in curvilinear coordinates are solved. Comparisons between numerical and analytical results are shown to be in excellent agreement.
    keyword(s): Temperature , Heat conduction , Electronics AND Heat transfer ,
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      A Zonal Decomposition Methodology for Detailed Temperature Field Evaluation

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/106769
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    contributor authorCha-Hsiang Tan
    contributor authorMichael Pecht
    date accessioned2017-05-08T23:32:23Z
    date available2017-05-08T23:32:23Z
    date copyrightSeptember, 1990
    date issued1990
    identifier issn1528-9044
    identifier otherJEPAE4-26117#260_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/106769
    description abstractA zonal decomposition technique is developed for temperature field and flux determination at both aligned and nonaligned grid interface boundaries. The method facilitates heat transfer problems commonly encountered in electronics including PWBs with multiple irregular boundaries in which numerical generation of boundary-fitted coordinates is required. To demonstrate the applicability and performance of the method, a 2-D heat conduction problem in Cartesian coordinates, a 2-D heat conduction problem in curvilinear coordinates, and a 3-D heat conduction problem in curvilinear coordinates are solved. Comparisons between numerical and analytical results are shown to be in excellent agreement.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Zonal Decomposition Methodology for Detailed Temperature Field Evaluation
    typeJournal Paper
    journal volume112
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2904376
    journal fristpage260
    journal lastpage266
    identifier eissn1043-7398
    keywordsTemperature
    keywordsHeat conduction
    keywordsElectronics AND Heat transfer
    treeJournal of Electronic Packaging:;1990:;volume( 112 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian