contributor author | Cha-Hsiang Tan | |
contributor author | Michael Pecht | |
date accessioned | 2017-05-08T23:32:23Z | |
date available | 2017-05-08T23:32:23Z | |
date copyright | September, 1990 | |
date issued | 1990 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26117#260_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/106769 | |
description abstract | A zonal decomposition technique is developed for temperature field and flux determination at both aligned and nonaligned grid interface boundaries. The method facilitates heat transfer problems commonly encountered in electronics including PWBs with multiple irregular boundaries in which numerical generation of boundary-fitted coordinates is required. To demonstrate the applicability and performance of the method, a 2-D heat conduction problem in Cartesian coordinates, a 2-D heat conduction problem in curvilinear coordinates, and a 3-D heat conduction problem in curvilinear coordinates are solved. Comparisons between numerical and analytical results are shown to be in excellent agreement. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A Zonal Decomposition Methodology for Detailed Temperature Field Evaluation | |
type | Journal Paper | |
journal volume | 112 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2904376 | |
journal fristpage | 260 | |
journal lastpage | 266 | |
identifier eissn | 1043-7398 | |
keywords | Temperature | |
keywords | Heat conduction | |
keywords | Electronics AND Heat transfer | |
tree | Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 003 | |
contenttype | Fulltext | |