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contributor authorCha-Hsiang Tan
contributor authorMichael Pecht
date accessioned2017-05-08T23:32:23Z
date available2017-05-08T23:32:23Z
date copyrightSeptember, 1990
date issued1990
identifier issn1528-9044
identifier otherJEPAE4-26117#260_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/106769
description abstractA zonal decomposition technique is developed for temperature field and flux determination at both aligned and nonaligned grid interface boundaries. The method facilitates heat transfer problems commonly encountered in electronics including PWBs with multiple irregular boundaries in which numerical generation of boundary-fitted coordinates is required. To demonstrate the applicability and performance of the method, a 2-D heat conduction problem in Cartesian coordinates, a 2-D heat conduction problem in curvilinear coordinates, and a 3-D heat conduction problem in curvilinear coordinates are solved. Comparisons between numerical and analytical results are shown to be in excellent agreement.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Zonal Decomposition Methodology for Detailed Temperature Field Evaluation
typeJournal Paper
journal volume112
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2904376
journal fristpage260
journal lastpage266
identifier eissn1043-7398
keywordsTemperature
keywordsHeat conduction
keywordsElectronics AND Heat transfer
treeJournal of Electronic Packaging:;1990:;volume( 112 ):;issue: 003
contenttypeFulltext


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