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    Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High Frequency “Breathing Modeâ€‌ Deformations in the Printed Wiring Board

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001::page 10914
    Author:
    Meng, Jingshi
    ,
    Dasgupta, Abhijit
    DOI: 10.1115/1.4032495
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Design rules for portable electronic device are continuously striving for thinner printed wiring assemblies (PWAs) and smaller clearances because of everincreasing demand for functionality and miniaturization. As a result, during accidental drop and impact events, there is an increased probability of internal secondary impact between a PWA and adjacent internal structures. In particular, compared to the initial impact, acceleration pulses caused by contact during secondary impacts are typically characterized by significant increase of amplitudes and frequency bandwidth. The resonant response in the thickness direction of printed wiring boards (PWBs) (termed the dynamic “breathing modeâ€‌ of response, in this study) acts as a mechanical bandpass filter and places miniature internal structures in some components (such as microelectromechanical systems (MEMS)) at risk of failure, if any of them have resonant frequencies within the transmitted frequency bandwidth. This study is the first part of a twopart series, presenting qualitative parametric insights into the effect of secondary impacts in a PWA. This first part focuses on analyzing the frequency spectrum of: (i) the impulse caused by secondary impact, (ii) the energy transmitted by the dynamic “breathingâ€‌ response of multilayer PWBs, and (iii) the consequential dynamic response of typical structures with high resonant frequencies that are mounted on the PWB. Examples include internal deformable structures in typical surface mount technology (SMT) components and in MEMS components. The second part of this series will further explore the effects of the breathing mode of vibration on failures of various SMT components of different frequencies.
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      Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High Frequency “Breathing Modeâ€‌ Deformations in the Printed Wiring Board

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    http://yetl.yabesh.ir/yetl1/handle/yetl/160801
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    contributor authorMeng, Jingshi
    contributor authorDasgupta, Abhijit
    date accessioned2017-05-09T01:27:26Z
    date available2017-05-09T01:27:26Z
    date issued2016
    identifier issn1528-9044
    identifier otherep_138_01_010914.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/160801
    description abstractDesign rules for portable electronic device are continuously striving for thinner printed wiring assemblies (PWAs) and smaller clearances because of everincreasing demand for functionality and miniaturization. As a result, during accidental drop and impact events, there is an increased probability of internal secondary impact between a PWA and adjacent internal structures. In particular, compared to the initial impact, acceleration pulses caused by contact during secondary impacts are typically characterized by significant increase of amplitudes and frequency bandwidth. The resonant response in the thickness direction of printed wiring boards (PWBs) (termed the dynamic “breathing modeâ€‌ of response, in this study) acts as a mechanical bandpass filter and places miniature internal structures in some components (such as microelectromechanical systems (MEMS)) at risk of failure, if any of them have resonant frequencies within the transmitted frequency bandwidth. This study is the first part of a twopart series, presenting qualitative parametric insights into the effect of secondary impacts in a PWA. This first part focuses on analyzing the frequency spectrum of: (i) the impulse caused by secondary impact, (ii) the energy transmitted by the dynamic “breathingâ€‌ response of multilayer PWBs, and (iii) the consequential dynamic response of typical structures with high resonant frequencies that are mounted on the PWB. Examples include internal deformable structures in typical surface mount technology (SMT) components and in MEMS components. The second part of this series will further explore the effects of the breathing mode of vibration on failures of various SMT components of different frequencies.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleInfluence of Secondary Impact on Printed Wiring Assemblies—Part I: High Frequency “Breathing Modeâ€‌ Deformations in the Printed Wiring Board
    typeJournal Paper
    journal volume138
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4032495
    journal fristpage10914
    journal lastpage10914
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian