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contributor authorMeng, Jingshi
contributor authorDasgupta, Abhijit
date accessioned2017-05-09T01:27:26Z
date available2017-05-09T01:27:26Z
date issued2016
identifier issn1528-9044
identifier otherep_138_01_010914.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/160801
description abstractDesign rules for portable electronic device are continuously striving for thinner printed wiring assemblies (PWAs) and smaller clearances because of everincreasing demand for functionality and miniaturization. As a result, during accidental drop and impact events, there is an increased probability of internal secondary impact between a PWA and adjacent internal structures. In particular, compared to the initial impact, acceleration pulses caused by contact during secondary impacts are typically characterized by significant increase of amplitudes and frequency bandwidth. The resonant response in the thickness direction of printed wiring boards (PWBs) (termed the dynamic “breathing modeâ€‌ of response, in this study) acts as a mechanical bandpass filter and places miniature internal structures in some components (such as microelectromechanical systems (MEMS)) at risk of failure, if any of them have resonant frequencies within the transmitted frequency bandwidth. This study is the first part of a twopart series, presenting qualitative parametric insights into the effect of secondary impacts in a PWA. This first part focuses on analyzing the frequency spectrum of: (i) the impulse caused by secondary impact, (ii) the energy transmitted by the dynamic “breathingâ€‌ response of multilayer PWBs, and (iii) the consequential dynamic response of typical structures with high resonant frequencies that are mounted on the PWB. Examples include internal deformable structures in typical surface mount technology (SMT) components and in MEMS components. The second part of this series will further explore the effects of the breathing mode of vibration on failures of various SMT components of different frequencies.
publisherThe American Society of Mechanical Engineers (ASME)
titleInfluence of Secondary Impact on Printed Wiring Assemblies—Part I: High Frequency “Breathing Modeâ€‌ Deformations in the Printed Wiring Board
typeJournal Paper
journal volume138
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4032495
journal fristpage10914
journal lastpage10914
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001
contenttypeFulltext


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