YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Microfeature Heat Exchanger Using Variable Density Arrays for Near Isothermal Cold Plate Operation

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001::page 10908
    Author:
    Gallandat, Noris
    ,
    Hesse, Danielle
    ,
    Rhett Mayor, J.
    DOI: 10.1115/1.4032347
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The purpose of this paper is to demonstrate the possibility to selectively tune the convective heat transfer coefficient in different sections of a heat sink by varying the density of microfeatures in order to minimize temperature gradients between discrete heat sources positioned along the flow path. Lifetime of power electronics is strongly correlated to the thermal management of the junction. Therefore, it is of interest to have constant junction temperatures across all devices in the array. Implementation of microfeature enhancement on the convective side improves the heat transfer due to an increase in surface area. Specific shapes such as microhydrofoils offer a reduced pressure drop allowing for combined improvement of heat transfer and flow performance. This study presents experimental results from an array of three discrete heat sources (20 أ— 15 mm) generating 100 W/cm2 and positioned in line along the flow path with a spacing of 10 mm between each of the sources. The heat sink was machined out of aluminum 6061, and microhydrofoils with a characteristic length of 500 خ¼m were embedded in the cold plate. The cooling medium used is water at a flow rate of 3.6–13.4 g/s corresponding to a Reynolds number of 420–1575. It is demonstrated that the baseplate temperature can be maintained below 90 آ°C, and the difference between the maximum temperatures of each heat source is less than 6.7 آ°C at a heat flux of 100 W/cm2 and a water flow rate of 4.8 g/s.
    • Download: (979.5Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Microfeature Heat Exchanger Using Variable Density Arrays for Near Isothermal Cold Plate Operation

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/160791
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorGallandat, Noris
    contributor authorHesse, Danielle
    contributor authorRhett Mayor, J.
    date accessioned2017-05-09T01:27:24Z
    date available2017-05-09T01:27:24Z
    date issued2016
    identifier issn1528-9044
    identifier otherep_138_01_010908.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/160791
    description abstractThe purpose of this paper is to demonstrate the possibility to selectively tune the convective heat transfer coefficient in different sections of a heat sink by varying the density of microfeatures in order to minimize temperature gradients between discrete heat sources positioned along the flow path. Lifetime of power electronics is strongly correlated to the thermal management of the junction. Therefore, it is of interest to have constant junction temperatures across all devices in the array. Implementation of microfeature enhancement on the convective side improves the heat transfer due to an increase in surface area. Specific shapes such as microhydrofoils offer a reduced pressure drop allowing for combined improvement of heat transfer and flow performance. This study presents experimental results from an array of three discrete heat sources (20 أ— 15 mm) generating 100 W/cm2 and positioned in line along the flow path with a spacing of 10 mm between each of the sources. The heat sink was machined out of aluminum 6061, and microhydrofoils with a characteristic length of 500 خ¼m were embedded in the cold plate. The cooling medium used is water at a flow rate of 3.6–13.4 g/s corresponding to a Reynolds number of 420–1575. It is demonstrated that the baseplate temperature can be maintained below 90 آ°C, and the difference between the maximum temperatures of each heat source is less than 6.7 آ°C at a heat flux of 100 W/cm2 and a water flow rate of 4.8 g/s.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleMicrofeature Heat Exchanger Using Variable Density Arrays for Near Isothermal Cold Plate Operation
    typeJournal Paper
    journal volume138
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4032347
    journal fristpage10908
    journal lastpage10908
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian