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contributor authorGallandat, Noris
contributor authorHesse, Danielle
contributor authorRhett Mayor, J.
date accessioned2017-05-09T01:27:24Z
date available2017-05-09T01:27:24Z
date issued2016
identifier issn1528-9044
identifier otherep_138_01_010908.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/160791
description abstractThe purpose of this paper is to demonstrate the possibility to selectively tune the convective heat transfer coefficient in different sections of a heat sink by varying the density of microfeatures in order to minimize temperature gradients between discrete heat sources positioned along the flow path. Lifetime of power electronics is strongly correlated to the thermal management of the junction. Therefore, it is of interest to have constant junction temperatures across all devices in the array. Implementation of microfeature enhancement on the convective side improves the heat transfer due to an increase in surface area. Specific shapes such as microhydrofoils offer a reduced pressure drop allowing for combined improvement of heat transfer and flow performance. This study presents experimental results from an array of three discrete heat sources (20 أ— 15 mm) generating 100 W/cm2 and positioned in line along the flow path with a spacing of 10 mm between each of the sources. The heat sink was machined out of aluminum 6061, and microhydrofoils with a characteristic length of 500 خ¼m were embedded in the cold plate. The cooling medium used is water at a flow rate of 3.6–13.4 g/s corresponding to a Reynolds number of 420–1575. It is demonstrated that the baseplate temperature can be maintained below 90 آ°C, and the difference between the maximum temperatures of each heat source is less than 6.7 آ°C at a heat flux of 100 W/cm2 and a water flow rate of 4.8 g/s.
publisherThe American Society of Mechanical Engineers (ASME)
titleMicrofeature Heat Exchanger Using Variable Density Arrays for Near Isothermal Cold Plate Operation
typeJournal Paper
journal volume138
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4032347
journal fristpage10908
journal lastpage10908
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001
contenttypeFulltext


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