Improved Flow Rate in Electro Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without NanoparticlesSource: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 002::page 21001DOI: 10.1115/1.4028746Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A new design for an electroosmotic flow (EOF) driven micropump was fabricated. Considering thermal management applications, three different types of micropumps were tested using multiple liquids. The micropumps were fabricated from a combination of materials, which included: siliconpolydimethylsiloxane (SiPDMS), GlassPDMS, or PDMSPDMS. The flow rates of the micropumps were experimentally and numerically assessed. Different combinations of materials and liquids resulted in variable values of zetapotential. The ranges of zetapotential for SiPDMS, GlassPDMS, and PDMSPDMS were −42.5–−50.7 mV, −76.0–−88.2 mV, and −76.0–−103.0 mV, respectively. The flow rates of the micropumps were proportional to their zetapotential values. In particular, flow rate values were found to be linearly proportional to the applied voltages below 500 V. A maximum flow rate of 75.9 خ¼L/min was achieved for the GlassPDMS micropump at 1 kV. At higher voltages nonlinearity and reduction in flow rate occurred due to Joule heating and the axial electroosmotic current leakage through the silicon substrate. The fabricated micropumps could deliver flow rates, which were orders of magnitude higher compared to the previously reported values for similar size micropumps. It is expected that such an increase in flow rate, particularly in the case of the SiPDMS micropump, would lead to enhanced heat transfer for microchip cooling applications as well as for applications involving micrototal analysis systems (خ¼TAS).
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| contributor author | Al | |
| contributor author | Roy, Ajit K. | |
| contributor author | Ganguli, Sabyasachi | |
| contributor author | Banerjee, Rupak K. | |
| date accessioned | 2017-05-09T01:16:55Z | |
| date available | 2017-05-09T01:16:55Z | |
| date issued | 2015 | |
| identifier issn | 1528-9044 | |
| identifier other | ep_137_02_021001.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/157674 | |
| description abstract | A new design for an electroosmotic flow (EOF) driven micropump was fabricated. Considering thermal management applications, three different types of micropumps were tested using multiple liquids. The micropumps were fabricated from a combination of materials, which included: siliconpolydimethylsiloxane (SiPDMS), GlassPDMS, or PDMSPDMS. The flow rates of the micropumps were experimentally and numerically assessed. Different combinations of materials and liquids resulted in variable values of zetapotential. The ranges of zetapotential for SiPDMS, GlassPDMS, and PDMSPDMS were −42.5–−50.7 mV, −76.0–−88.2 mV, and −76.0–−103.0 mV, respectively. The flow rates of the micropumps were proportional to their zetapotential values. In particular, flow rate values were found to be linearly proportional to the applied voltages below 500 V. A maximum flow rate of 75.9 خ¼L/min was achieved for the GlassPDMS micropump at 1 kV. At higher voltages nonlinearity and reduction in flow rate occurred due to Joule heating and the axial electroosmotic current leakage through the silicon substrate. The fabricated micropumps could deliver flow rates, which were orders of magnitude higher compared to the previously reported values for similar size micropumps. It is expected that such an increase in flow rate, particularly in the case of the SiPDMS micropump, would lead to enhanced heat transfer for microchip cooling applications as well as for applications involving micrototal analysis systems (خ¼TAS). | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Improved Flow Rate in Electro Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without Nanoparticles | |
| type | Journal Paper | |
| journal volume | 137 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4028746 | |
| journal fristpage | 21001 | |
| journal lastpage | 21001 | |
| identifier eissn | 1043-7398 | |
| tree | Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 002 | |
| contenttype | Fulltext |