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contributor authorAl
contributor authorRoy, Ajit K.
contributor authorGanguli, Sabyasachi
contributor authorBanerjee, Rupak K.
date accessioned2017-05-09T01:16:55Z
date available2017-05-09T01:16:55Z
date issued2015
identifier issn1528-9044
identifier otherep_137_02_021001.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/157674
description abstractA new design for an electroosmotic flow (EOF) driven micropump was fabricated. Considering thermal management applications, three different types of micropumps were tested using multiple liquids. The micropumps were fabricated from a combination of materials, which included: siliconpolydimethylsiloxane (SiPDMS), GlassPDMS, or PDMSPDMS. The flow rates of the micropumps were experimentally and numerically assessed. Different combinations of materials and liquids resulted in variable values of zetapotential. The ranges of zetapotential for SiPDMS, GlassPDMS, and PDMSPDMS were −42.5–−50.7 mV, −76.0–−88.2 mV, and −76.0–−103.0 mV, respectively. The flow rates of the micropumps were proportional to their zetapotential values. In particular, flow rate values were found to be linearly proportional to the applied voltages below 500 V. A maximum flow rate of 75.9 خ¼L/min was achieved for the GlassPDMS micropump at 1 kV. At higher voltages nonlinearity and reduction in flow rate occurred due to Joule heating and the axial electroosmotic current leakage through the silicon substrate. The fabricated micropumps could deliver flow rates, which were orders of magnitude higher compared to the previously reported values for similar size micropumps. It is expected that such an increase in flow rate, particularly in the case of the SiPDMS micropump, would lead to enhanced heat transfer for microchip cooling applications as well as for applications involving micrototal analysis systems (خ¼TAS).
publisherThe American Society of Mechanical Engineers (ASME)
titleImproved Flow Rate in Electro Osmotic Micropumps for Combinations of Substrates and Different Liquids With and Without Nanoparticles
typeJournal Paper
journal volume137
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4028746
journal fristpage21001
journal lastpage21001
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2015:;volume( 137 ):;issue: 002
contenttypeFulltext


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