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    Compact Model Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three Dimensional Stacked Pin Fin Enhanced Microgap

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 001::page 11008
    Author:
    Han, Xuefei
    ,
    Joshi, Yogendra K.
    DOI: 10.1115/1.4028574
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Overcooling of electronic devices and systems results in excess energy consumption, which can be reduced by closely linking cooling requirements with actual power dissipation. A thermal modelbased flow rate controller for single phase liquid cooled single tier and threedimensional (3D) stacked chips, using pinfin enhanced microgap was studied in this paper. Thermal compact models of a planar and 3D stacked twolayer pinfin enhanced microgap were developed, which ran 104105 times faster than using fullfield computational fluid dynamics/heat transfer (CFD/HT) method, with reasonable accuracy and spatial details. Compact model was used in conjunction with a flow rate control strategy to provide the needed amount of liquid to cool the heat sources to the desired temperature range. Example case studies show that the estimated energy savings in pump power is about 25% compared with pumping fluid at a constant flow rate.
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      Compact Model Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three Dimensional Stacked Pin Fin Enhanced Microgap

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    http://yetl.yabesh.ir/yetl1/handle/yetl/157665
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    contributor authorHan, Xuefei
    contributor authorJoshi, Yogendra K.
    date accessioned2017-05-09T01:16:54Z
    date available2017-05-09T01:16:54Z
    date issued2015
    identifier issn1528-9044
    identifier otherep_137_01_011008.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/157665
    description abstractOvercooling of electronic devices and systems results in excess energy consumption, which can be reduced by closely linking cooling requirements with actual power dissipation. A thermal modelbased flow rate controller for single phase liquid cooled single tier and threedimensional (3D) stacked chips, using pinfin enhanced microgap was studied in this paper. Thermal compact models of a planar and 3D stacked twolayer pinfin enhanced microgap were developed, which ran 104105 times faster than using fullfield computational fluid dynamics/heat transfer (CFD/HT) method, with reasonable accuracy and spatial details. Compact model was used in conjunction with a flow rate control strategy to provide the needed amount of liquid to cool the heat sources to the desired temperature range. Example case studies show that the estimated energy savings in pump power is about 25% compared with pumping fluid at a constant flow rate.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleCompact Model Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three Dimensional Stacked Pin Fin Enhanced Microgap
    typeJournal Paper
    journal volume137
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4028574
    journal fristpage11008
    journal lastpage11008
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2015:;volume( 137 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian