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contributor authorHan, Xuefei
contributor authorJoshi, Yogendra K.
date accessioned2017-05-09T01:16:54Z
date available2017-05-09T01:16:54Z
date issued2015
identifier issn1528-9044
identifier otherep_137_01_011008.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/157665
description abstractOvercooling of electronic devices and systems results in excess energy consumption, which can be reduced by closely linking cooling requirements with actual power dissipation. A thermal modelbased flow rate controller for single phase liquid cooled single tier and threedimensional (3D) stacked chips, using pinfin enhanced microgap was studied in this paper. Thermal compact models of a planar and 3D stacked twolayer pinfin enhanced microgap were developed, which ran 104105 times faster than using fullfield computational fluid dynamics/heat transfer (CFD/HT) method, with reasonable accuracy and spatial details. Compact model was used in conjunction with a flow rate control strategy to provide the needed amount of liquid to cool the heat sources to the desired temperature range. Example case studies show that the estimated energy savings in pump power is about 25% compared with pumping fluid at a constant flow rate.
publisherThe American Society of Mechanical Engineers (ASME)
titleCompact Model Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three Dimensional Stacked Pin Fin Enhanced Microgap
typeJournal Paper
journal volume137
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4028574
journal fristpage11008
journal lastpage11008
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2015:;volume( 137 ):;issue: 001
contenttypeFulltext


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