Experimental and Modeling Studies of Looping Process for Wire BondingSource: Journal of Electronic Packaging:;2013:;volume( 135 ):;issue: 004::page 41009DOI: 10.1115/1.4025667Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Looping is one of the key technologies for modern thermosonic wire bonders, and it has been affected by many interacting factors. In this study, the wire looping process was observed with a highspeed camera, and the evolution of wire profiles during looping and the capillary trace were obtained through experiments. A dynamic finite element (FE) model was developed to learn the details of the looping process, where real capillary geometry dimensions, capillary trace, diameter of bonded ball and the gold wire material were used, and the friction force and air tension force were considered. The simulated profiles were compared with those of the experiment. Using the verified FE model, the effects of material properties, capillary parameters, and capillary traces on the looping process were studied, and the relationships between the final profiles and parameters were discussed.
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| contributor author | Wang, Fuliang | |
| contributor author | Chen, Yun | |
| date accessioned | 2017-05-09T00:57:46Z | |
| date available | 2017-05-09T00:57:46Z | |
| date issued | 2013 | |
| identifier issn | 1528-9044 | |
| identifier other | ep_135_04_041009.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/151449 | |
| description abstract | Looping is one of the key technologies for modern thermosonic wire bonders, and it has been affected by many interacting factors. In this study, the wire looping process was observed with a highspeed camera, and the evolution of wire profiles during looping and the capillary trace were obtained through experiments. A dynamic finite element (FE) model was developed to learn the details of the looping process, where real capillary geometry dimensions, capillary trace, diameter of bonded ball and the gold wire material were used, and the friction force and air tension force were considered. The simulated profiles were compared with those of the experiment. Using the verified FE model, the effects of material properties, capillary parameters, and capillary traces on the looping process were studied, and the relationships between the final profiles and parameters were discussed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Experimental and Modeling Studies of Looping Process for Wire Bonding | |
| type | Journal Paper | |
| journal volume | 135 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4025667 | |
| journal fristpage | 41009 | |
| journal lastpage | 41009 | |
| identifier eissn | 1043-7398 | |
| tree | Journal of Electronic Packaging:;2013:;volume( 135 ):;issue: 004 | |
| contenttype | Fulltext |