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contributor authorWang, Fuliang
contributor authorChen, Yun
date accessioned2017-05-09T00:57:46Z
date available2017-05-09T00:57:46Z
date issued2013
identifier issn1528-9044
identifier otherep_135_04_041009.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/151449
description abstractLooping is one of the key technologies for modern thermosonic wire bonders, and it has been affected by many interacting factors. In this study, the wire looping process was observed with a highspeed camera, and the evolution of wire profiles during looping and the capillary trace were obtained through experiments. A dynamic finite element (FE) model was developed to learn the details of the looping process, where real capillary geometry dimensions, capillary trace, diameter of bonded ball and the gold wire material were used, and the friction force and air tension force were considered. The simulated profiles were compared with those of the experiment. Using the verified FE model, the effects of material properties, capillary parameters, and capillary traces on the looping process were studied, and the relationships between the final profiles and parameters were discussed.
publisherThe American Society of Mechanical Engineers (ASME)
titleExperimental and Modeling Studies of Looping Process for Wire Bonding
typeJournal Paper
journal volume135
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4025667
journal fristpage41009
journal lastpage41009
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 004
contenttypeFulltext


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