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    The Standardization of Printable Materials and Direct Writing Systems

    Source: Journal of Electronic Packaging:;2013:;volume( 135 ):;issue: 001::page 11006
    Author:
    Hoffman, Jessica
    ,
    Hwang, Seyeon
    ,
    Ortega, Ada
    ,
    Kim, Nam
    ,
    Moon, Kyoung
    DOI: 10.1115/1.4023809
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Directwriting systems will be leading the future of additive manufacturing in that they have simple and costeffective processes. There are various types of directwriting systems, such as the rolltoroll (R2R), microdispensing deposition write (MDDW), maskless mesoscale materials deposition (M3D), and inkjet systems. These technologies are being used for the production of radio frequency identification tags (RFIDs), organic lightemitting diodes (OLEDs), lightemitting diodes (LEDs), flexible electronics, solar cells, antennas, etc. Recently, the standardization of printing materials and equipment has become a key issue in the printed electronics industry. The standardization of printed electronics can be categorized into four parts: equipment, materials, testing methods, and the education of this technology.
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      The Standardization of Printable Materials and Direct Writing Systems

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    http://yetl.yabesh.ir/yetl1/handle/yetl/151403
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    contributor authorHoffman, Jessica
    contributor authorHwang, Seyeon
    contributor authorOrtega, Ada
    contributor authorKim, Nam
    contributor authorMoon, Kyoung
    date accessioned2017-05-09T00:57:37Z
    date available2017-05-09T00:57:37Z
    date issued2013
    identifier issn1528-9044
    identifier otherep_135_1_011006.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/151403
    description abstractDirectwriting systems will be leading the future of additive manufacturing in that they have simple and costeffective processes. There are various types of directwriting systems, such as the rolltoroll (R2R), microdispensing deposition write (MDDW), maskless mesoscale materials deposition (M3D), and inkjet systems. These technologies are being used for the production of radio frequency identification tags (RFIDs), organic lightemitting diodes (OLEDs), lightemitting diodes (LEDs), flexible electronics, solar cells, antennas, etc. Recently, the standardization of printing materials and equipment has become a key issue in the printed electronics industry. The standardization of printed electronics can be categorized into four parts: equipment, materials, testing methods, and the education of this technology.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThe Standardization of Printable Materials and Direct Writing Systems
    typeJournal Paper
    journal volume135
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4023809
    journal fristpage11006
    journal lastpage11006
    identifier eissn1043-7398
    treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian