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contributor authorHoffman, Jessica
contributor authorHwang, Seyeon
contributor authorOrtega, Ada
contributor authorKim, Nam
contributor authorMoon, Kyoung
date accessioned2017-05-09T00:57:37Z
date available2017-05-09T00:57:37Z
date issued2013
identifier issn1528-9044
identifier otherep_135_1_011006.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/151403
description abstractDirectwriting systems will be leading the future of additive manufacturing in that they have simple and costeffective processes. There are various types of directwriting systems, such as the rolltoroll (R2R), microdispensing deposition write (MDDW), maskless mesoscale materials deposition (M3D), and inkjet systems. These technologies are being used for the production of radio frequency identification tags (RFIDs), organic lightemitting diodes (OLEDs), lightemitting diodes (LEDs), flexible electronics, solar cells, antennas, etc. Recently, the standardization of printing materials and equipment has become a key issue in the printed electronics industry. The standardization of printed electronics can be categorized into four parts: equipment, materials, testing methods, and the education of this technology.
publisherThe American Society of Mechanical Engineers (ASME)
titleThe Standardization of Printable Materials and Direct Writing Systems
typeJournal Paper
journal volume135
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4023809
journal fristpage11006
journal lastpage11006
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 001
contenttypeFulltext


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