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    Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 001::page 11002
    Author:
    R. A. Wirtz
    ,
    K. Swanson
    ,
    M. Yaquinto
    DOI: 10.1115/1.4005915
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An important design objective that is unique to hand-held units is the need to constrain two temperatures: the maximum temperature of the electronic components and the maximum skin temperature of the hand-held unit. The present work identifies and evaluates, through parametric modeling and experiments, the passive thermal energy storage volume characteristics and phase change material composite properties that are most suitable for thermal control of small form-factor, high power-density, hand-held electronics. A one-dimensional transient analytical model, based on an integral heat balance, is formulated and benchmarked. The model accurately simulates the heat storage/recovery process in a semi-infinite, “dry” phase change material slab. Dimensional analysis identifies the time and temperature metrics and nondimensional parameters that describe the heat storage/release process. Parametric analysis illustrates how changes in these nondimensional parameters affect thermal energy storage volume thermal response.
    keyword(s): Density , Heat , Temperature , Phase transitions , Skin , Thermal energy storage , Electronics , Thermal management , Cooling , Heating AND Design ,
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      Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/148603
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    • Journal of Electronic Packaging

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    contributor authorR. A. Wirtz
    contributor authorK. Swanson
    contributor authorM. Yaquinto
    date accessioned2017-05-09T00:49:33Z
    date available2017-05-09T00:49:33Z
    date copyrightMarch, 2012
    date issued2012
    identifier issn1528-9044
    identifier otherJEPAE4-26323#011002_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/148603
    description abstractAn important design objective that is unique to hand-held units is the need to constrain two temperatures: the maximum temperature of the electronic components and the maximum skin temperature of the hand-held unit. The present work identifies and evaluates, through parametric modeling and experiments, the passive thermal energy storage volume characteristics and phase change material composite properties that are most suitable for thermal control of small form-factor, high power-density, hand-held electronics. A one-dimensional transient analytical model, based on an integral heat balance, is formulated and benchmarked. The model accurately simulates the heat storage/recovery process in a semi-infinite, “dry” phase change material slab. Dimensional analysis identifies the time and temperature metrics and nondimensional parameters that describe the heat storage/release process. Parametric analysis illustrates how changes in these nondimensional parameters affect thermal energy storage volume thermal response.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics
    typeJournal Paper
    journal volume134
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4005915
    journal fristpage11002
    identifier eissn1043-7398
    keywordsDensity
    keywordsHeat
    keywordsTemperature
    keywordsPhase transitions
    keywordsSkin
    keywordsThermal energy storage
    keywordsElectronics
    keywordsThermal management
    keywordsCooling
    keywordsHeating AND Design
    treeJournal of Electronic Packaging:;2012:;volume( 134 ):;issue: 001
    contenttypeFulltext
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