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contributor authorR. A. Wirtz
contributor authorK. Swanson
contributor authorM. Yaquinto
date accessioned2017-05-09T00:49:33Z
date available2017-05-09T00:49:33Z
date copyrightMarch, 2012
date issued2012
identifier issn1528-9044
identifier otherJEPAE4-26323#011002_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/148603
description abstractAn important design objective that is unique to hand-held units is the need to constrain two temperatures: the maximum temperature of the electronic components and the maximum skin temperature of the hand-held unit. The present work identifies and evaluates, through parametric modeling and experiments, the passive thermal energy storage volume characteristics and phase change material composite properties that are most suitable for thermal control of small form-factor, high power-density, hand-held electronics. A one-dimensional transient analytical model, based on an integral heat balance, is formulated and benchmarked. The model accurately simulates the heat storage/recovery process in a semi-infinite, “dry” phase change material slab. Dimensional analysis identifies the time and temperature metrics and nondimensional parameters that describe the heat storage/release process. Parametric analysis illustrates how changes in these nondimensional parameters affect thermal energy storage volume thermal response.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics
typeJournal Paper
journal volume134
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4005915
journal fristpage11002
identifier eissn1043-7398
keywordsDensity
keywordsHeat
keywordsTemperature
keywordsPhase transitions
keywordsSkin
keywordsThermal energy storage
keywordsElectronics
keywordsThermal management
keywordsCooling
keywordsHeating AND Design
treeJournal of Electronic Packaging:;2012:;volume( 134 ):;issue: 001
contenttypeFulltext


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