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    Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 003::page 34501
    Author:
    A. Tamayol
    ,
    F. McGregor
    ,
    M. Bahrami
    DOI: 10.1115/1.4007077
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Passive heat transfer from enclosures with rectangular fins is studied both experimentally and theoretically. Several sample enclosures with various lengths are prepared and tested. To calibrate the thermal measurements and the analyses, enclosures without fins (“bare” enclosures) are also prepared and tested. Surface temperature distribution is determined for various enclosure lengths and heat generation rates. Existing relationships for natural convection and radiation heat transfer are used to calculate the heat transfer rate from the tested samples. The theoretical results successfully predict the trends observed in the experimental data. It is observed that the contribution of the radiation heat transfer is on the order of 50% of the total heat transfer for the tested enclosures. As such, a new correlation is reported for calculating an optimum fin spacing for vertically-mounted uniformly finned surfaces, with rectangular straight fins that takes into account both natural convection and radiation.
    keyword(s): Temperature , Heat transfer , Radiation (Physics) , Natural convection , Fins AND Heat ,
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      Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/148582
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    • Journal of Electronic Packaging

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    contributor authorA. Tamayol
    contributor authorF. McGregor
    contributor authorM. Bahrami
    date accessioned2017-05-09T00:49:26Z
    date available2017-05-09T00:49:26Z
    date copyrightSeptember, 2012
    date issued2012
    identifier issn1528-9044
    identifier otherJEPAE4-926029#034501_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/148582
    description abstractPassive heat transfer from enclosures with rectangular fins is studied both experimentally and theoretically. Several sample enclosures with various lengths are prepared and tested. To calibrate the thermal measurements and the analyses, enclosures without fins (“bare” enclosures) are also prepared and tested. Surface temperature distribution is determined for various enclosure lengths and heat generation rates. Existing relationships for natural convection and radiation heat transfer are used to calculate the heat transfer rate from the tested samples. The theoretical results successfully predict the trends observed in the experimental data. It is observed that the contribution of the radiation heat transfer is on the order of 50% of the total heat transfer for the tested enclosures. As such, a new correlation is reported for calculating an optimum fin spacing for vertically-mounted uniformly finned surfaces, with rectangular straight fins that takes into account both natural convection and radiation.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins
    typeJournal Paper
    journal volume134
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4007077
    journal fristpage34501
    identifier eissn1043-7398
    keywordsTemperature
    keywordsHeat transfer
    keywordsRadiation (Physics)
    keywordsNatural convection
    keywordsFins AND Heat
    treeJournal of Electronic Packaging:;2012:;volume( 134 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian