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    Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 003::page 31009
    Author:
    Sarah Kim
    ,
    Yoon Jo Kim
    ,
    Yogendra K. Joshi
    ,
    Paul A. Kohl
    ,
    Andrei G. Fedorov
    DOI: 10.1115/1.4007111
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The ionic liquid butylmethylimidazolium hexafluorophosphate (bmim)(PF6 ) and five different hydrofluorocarbon refrigerants were investigated as the working fluid pairs for a waste-heat driven absorption heat pump system for possible applications in electronics thermal management. A significant amount of the energy consumed in large electronic systems is used for cooling, resulting in low grade waste heat, which can be used to drive an absorption refrigeration system if a suitable working fluids can be identified. The Redlich–Kwong-type equation of state was used to model the thermodynamic conditions and the binary mixture properties at the corresponding states. The effects of desorber and absorber temperatures, waste-heat quality, and system design on the heat pump performance were investigated. Supporting experiments using R134a/(bmim)(PF6 ) as the working fluid pair were performed. Desorber and absorber outlet temperatures were varied by adjusting the desorber supply power and the coolant temperature at the evaporator inlet, respectively. For an evaporator temperature of 41 °C, which is relevant to electronics cooling applications, the maximum cooling-to-total-energy input was 0.35 with the evaporator cooling capability of 36 W and the desorber outlet temperature in the range of 50 to 110 °C.
    keyword(s): Temperature , Fluids , Absorption , Refrigeration , Heat pumps , Refrigerants , Cooling , Mixtures , Waste heat , Heat AND Pressure ,
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      Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants

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    http://yetl.yabesh.ir/yetl1/handle/yetl/148580
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    contributor authorSarah Kim
    contributor authorYoon Jo Kim
    contributor authorYogendra K. Joshi
    contributor authorPaul A. Kohl
    contributor authorAndrei G. Fedorov
    date accessioned2017-05-09T00:49:25Z
    date available2017-05-09T00:49:25Z
    date copyrightSeptember, 2012
    date issued2012
    identifier issn1528-9044
    identifier otherJEPAE4-926029#031009_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/148580
    description abstractThe ionic liquid butylmethylimidazolium hexafluorophosphate (bmim)(PF6 ) and five different hydrofluorocarbon refrigerants were investigated as the working fluid pairs for a waste-heat driven absorption heat pump system for possible applications in electronics thermal management. A significant amount of the energy consumed in large electronic systems is used for cooling, resulting in low grade waste heat, which can be used to drive an absorption refrigeration system if a suitable working fluids can be identified. The Redlich–Kwong-type equation of state was used to model the thermodynamic conditions and the binary mixture properties at the corresponding states. The effects of desorber and absorber temperatures, waste-heat quality, and system design on the heat pump performance were investigated. Supporting experiments using R134a/(bmim)(PF6 ) as the working fluid pair were performed. Desorber and absorber outlet temperatures were varied by adjusting the desorber supply power and the coolant temperature at the evaporator inlet, respectively. For an evaporator temperature of 41 °C, which is relevant to electronics cooling applications, the maximum cooling-to-total-energy input was 0.35 with the evaporator cooling capability of 36 W and the desorber outlet temperature in the range of 50 to 110 °C.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAbsorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants
    typeJournal Paper
    journal volume134
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4007111
    journal fristpage31009
    identifier eissn1043-7398
    keywordsTemperature
    keywordsFluids
    keywordsAbsorption
    keywordsRefrigeration
    keywordsHeat pumps
    keywordsRefrigerants
    keywordsCooling
    keywordsMixtures
    keywordsWaste heat
    keywordsHeat AND Pressure
    treeJournal of Electronic Packaging:;2012:;volume( 134 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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