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contributor authorSarah Kim
contributor authorYoon Jo Kim
contributor authorYogendra K. Joshi
contributor authorPaul A. Kohl
contributor authorAndrei G. Fedorov
date accessioned2017-05-09T00:49:25Z
date available2017-05-09T00:49:25Z
date copyrightSeptember, 2012
date issued2012
identifier issn1528-9044
identifier otherJEPAE4-926029#031009_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/148580
description abstractThe ionic liquid butylmethylimidazolium hexafluorophosphate (bmim)(PF6 ) and five different hydrofluorocarbon refrigerants were investigated as the working fluid pairs for a waste-heat driven absorption heat pump system for possible applications in electronics thermal management. A significant amount of the energy consumed in large electronic systems is used for cooling, resulting in low grade waste heat, which can be used to drive an absorption refrigeration system if a suitable working fluids can be identified. The Redlich–Kwong-type equation of state was used to model the thermodynamic conditions and the binary mixture properties at the corresponding states. The effects of desorber and absorber temperatures, waste-heat quality, and system design on the heat pump performance were investigated. Supporting experiments using R134a/(bmim)(PF6 ) as the working fluid pair were performed. Desorber and absorber outlet temperatures were varied by adjusting the desorber supply power and the coolant temperature at the evaporator inlet, respectively. For an evaporator temperature of 41 °C, which is relevant to electronics cooling applications, the maximum cooling-to-total-energy input was 0.35 with the evaporator cooling capability of 36 W and the desorber outlet temperature in the range of 50 to 110 °C.
publisherThe American Society of Mechanical Engineers (ASME)
titleAbsorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants
typeJournal Paper
journal volume134
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4007111
journal fristpage31009
identifier eissn1043-7398
keywordsTemperature
keywordsFluids
keywordsAbsorption
keywordsRefrigeration
keywordsHeat pumps
keywordsRefrigerants
keywordsCooling
keywordsMixtures
keywordsWaste heat
keywordsHeat AND Pressure
treeJournal of Electronic Packaging:;2012:;volume( 134 ):;issue: 003
contenttypeFulltext


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