| contributor author | Lin Hu | |
| contributor author | William Evans | |
| contributor author | Pawel Keblinski | |
| date accessioned | 2017-05-09T00:43:12Z | |
| date available | 2017-05-09T00:43:12Z | |
| date copyright | June, 2011 | |
| date issued | 2011 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26313#021002_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/145807 | |
| description abstract | We present a concept for development of high thermal conductivity thermal interface materials (TIMs) via a rapid formation of conductive network. In particular we use molecular dynamics simulations to demonstrate the possibility of a formation of a network of solid nanoparticles in liquid solution and establish wetting and volume fraction conditions required for a rapid formation of such network. Then, we use Monte-Carlo simulations to determine effective thermal conductivity of the solid/liquid composite material. The presence of a percolating network dramatically increases the effective thermal conductivity, as compared to values characterizing dispersed particle structures. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials | |
| type | Journal Paper | |
| journal volume | 133 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4003865 | |
| journal fristpage | 21002 | |
| identifier eissn | 1043-7398 | |
| keywords | Particulate matter | |
| keywords | Thermal conductivity | |
| keywords | Networks | |
| keywords | Nanoparticles | |
| keywords | Composite materials | |
| keywords | Self-assembly | |
| keywords | Molecular dynamics simulation | |
| keywords | Wetting (Surface science) AND Engineering simulation | |
| tree | Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002 | |
| contenttype | Fulltext | |