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    Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002::page 21002
    Author:
    Lin Hu
    ,
    William Evans
    ,
    Pawel Keblinski
    DOI: 10.1115/1.4003865
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We present a concept for development of high thermal conductivity thermal interface materials (TIMs) via a rapid formation of conductive network. In particular we use molecular dynamics simulations to demonstrate the possibility of a formation of a network of solid nanoparticles in liquid solution and establish wetting and volume fraction conditions required for a rapid formation of such network. Then, we use Monte-Carlo simulations to determine effective thermal conductivity of the solid/liquid composite material. The presence of a percolating network dramatically increases the effective thermal conductivity, as compared to values characterizing dispersed particle structures.
    keyword(s): Particulate matter , Thermal conductivity , Networks , Nanoparticles , Composite materials , Self-assembly , Molecular dynamics simulation , Wetting (Surface science) AND Engineering simulation ,
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      Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/145807
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    contributor authorLin Hu
    contributor authorWilliam Evans
    contributor authorPawel Keblinski
    date accessioned2017-05-09T00:43:12Z
    date available2017-05-09T00:43:12Z
    date copyrightJune, 2011
    date issued2011
    identifier issn1528-9044
    identifier otherJEPAE4-26313#021002_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/145807
    description abstractWe present a concept for development of high thermal conductivity thermal interface materials (TIMs) via a rapid formation of conductive network. In particular we use molecular dynamics simulations to demonstrate the possibility of a formation of a network of solid nanoparticles in liquid solution and establish wetting and volume fraction conditions required for a rapid formation of such network. Then, we use Monte-Carlo simulations to determine effective thermal conductivity of the solid/liquid composite material. The presence of a percolating network dramatically increases the effective thermal conductivity, as compared to values characterizing dispersed particle structures.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials
    typeJournal Paper
    journal volume133
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4003865
    journal fristpage21002
    identifier eissn1043-7398
    keywordsParticulate matter
    keywordsThermal conductivity
    keywordsNetworks
    keywordsNanoparticles
    keywordsComposite materials
    keywordsSelf-assembly
    keywordsMolecular dynamics simulation
    keywordsWetting (Surface science) AND Engineering simulation
    treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian