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contributor authorLin Hu
contributor authorWilliam Evans
contributor authorPawel Keblinski
date accessioned2017-05-09T00:43:12Z
date available2017-05-09T00:43:12Z
date copyrightJune, 2011
date issued2011
identifier issn1528-9044
identifier otherJEPAE4-26313#021002_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/145807
description abstractWe present a concept for development of high thermal conductivity thermal interface materials (TIMs) via a rapid formation of conductive network. In particular we use molecular dynamics simulations to demonstrate the possibility of a formation of a network of solid nanoparticles in liquid solution and establish wetting and volume fraction conditions required for a rapid formation of such network. Then, we use Monte-Carlo simulations to determine effective thermal conductivity of the solid/liquid composite material. The presence of a percolating network dramatically increases the effective thermal conductivity, as compared to values characterizing dispersed particle structures.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials
typeJournal Paper
journal volume133
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4003865
journal fristpage21002
identifier eissn1043-7398
keywordsParticulate matter
keywordsThermal conductivity
keywordsNetworks
keywordsNanoparticles
keywordsComposite materials
keywordsSelf-assembly
keywordsMolecular dynamics simulation
keywordsWetting (Surface science) AND Engineering simulation
treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002
contenttypeFulltext


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