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    Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002::page 20907
    Author:
    Stephen L. Hodson
    ,
    Thiruvelu Bhuvana
    ,
    Baratunde A. Cola
    ,
    Xianfan Xu
    ,
    G. U. Kulkarni
    ,
    Timothy S. Fisher
    DOI: 10.1115/1.4004094
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC16 H35 )2 , to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The Pd weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium-bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250°C, one-sided and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm2 K/W and 5 mm2 K/W, respectively.
    keyword(s): Carbon nanotubes , Nanoparticles , Palladium , Bonding AND Temperature ,
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      Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces

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    http://yetl.yabesh.ir/yetl1/handle/yetl/145803
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    contributor authorStephen L. Hodson
    contributor authorThiruvelu Bhuvana
    contributor authorBaratunde A. Cola
    contributor authorXianfan Xu
    contributor authorG. U. Kulkarni
    contributor authorTimothy S. Fisher
    date accessioned2017-05-09T00:43:11Z
    date available2017-05-09T00:43:11Z
    date copyrightJune, 2011
    date issued2011
    identifier issn1528-9044
    identifier otherJEPAE4-26313#020907_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/145803
    description abstractCarbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC16 H35 )2 , to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The Pd weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium-bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250°C, one-sided and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm2 K/W and 5 mm2 K/W, respectively.
    publisherThe American Society of Mechanical Engineers (ASME)
    titlePalladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces
    typeJournal Paper
    journal volume133
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4004094
    journal fristpage20907
    identifier eissn1043-7398
    keywordsCarbon nanotubes
    keywordsNanoparticles
    keywordsPalladium
    keywordsBonding AND Temperature
    treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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