Palladium Thiolate Bonding of Carbon Nanotube Thermal InterfacesSource: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002::page 20907Author:Stephen L. Hodson
,
Thiruvelu Bhuvana
,
Baratunde A. Cola
,
Xianfan Xu
,
G. U. Kulkarni
,
Timothy S. Fisher
DOI: 10.1115/1.4004094Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC16 H35 )2 , to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The Pd weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium-bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250°C, one-sided and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm2 K/W and 5 mm2 K/W, respectively.
keyword(s): Carbon nanotubes , Nanoparticles , Palladium , Bonding AND Temperature ,
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| contributor author | Stephen L. Hodson | |
| contributor author | Thiruvelu Bhuvana | |
| contributor author | Baratunde A. Cola | |
| contributor author | Xianfan Xu | |
| contributor author | G. U. Kulkarni | |
| contributor author | Timothy S. Fisher | |
| date accessioned | 2017-05-09T00:43:11Z | |
| date available | 2017-05-09T00:43:11Z | |
| date copyright | June, 2011 | |
| date issued | 2011 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26313#020907_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/145803 | |
| description abstract | Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC16 H35 )2 , to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The Pd weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium-bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250°C, one-sided and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm2 K/W and 5 mm2 K/W, respectively. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces | |
| type | Journal Paper | |
| journal volume | 133 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4004094 | |
| journal fristpage | 20907 | |
| identifier eissn | 1043-7398 | |
| keywords | Carbon nanotubes | |
| keywords | Nanoparticles | |
| keywords | Palladium | |
| keywords | Bonding AND Temperature | |
| tree | Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002 | |
| contenttype | Fulltext |