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contributor authorStephen L. Hodson
contributor authorThiruvelu Bhuvana
contributor authorBaratunde A. Cola
contributor authorXianfan Xu
contributor authorG. U. Kulkarni
contributor authorTimothy S. Fisher
date accessioned2017-05-09T00:43:11Z
date available2017-05-09T00:43:11Z
date copyrightJune, 2011
date issued2011
identifier issn1528-9044
identifier otherJEPAE4-26313#020907_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/145803
description abstractCarbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC16 H35 )2 , to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The Pd weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium-bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250°C, one-sided and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm2 K/W and 5 mm2 K/W, respectively.
publisherThe American Society of Mechanical Engineers (ASME)
titlePalladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces
typeJournal Paper
journal volume133
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4004094
journal fristpage20907
identifier eissn1043-7398
keywordsCarbon nanotubes
keywordsNanoparticles
keywordsPalladium
keywordsBonding AND Temperature
treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002
contenttypeFulltext


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