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    Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003::page 31011
    Author:
    Xin Li
    ,
    Xu Chen
    ,
    Guo-Quan Lu
    DOI: 10.1115/1.4002299
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.
    keyword(s): Heat , Temperature , Silver , Solders , Reliability , Epoxy adhesives , Light-emitting diodes , Thermal conductivity , Bonding , Packaging AND Energy dissipation ,
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      Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

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    http://yetl.yabesh.ir/yetl1/handle/yetl/142953
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    contributor authorXin Li
    contributor authorXu Chen
    contributor authorGuo-Quan Lu
    date accessioned2017-05-09T00:37:13Z
    date available2017-05-09T00:37:13Z
    date copyrightSeptember, 2010
    date issued2010
    identifier issn1528-9044
    identifier otherJEPAE4-26306#031011_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/142953
    description abstractAs a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleReliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials
    typeJournal Paper
    journal volume132
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4002299
    journal fristpage31011
    identifier eissn1043-7398
    keywordsHeat
    keywordsTemperature
    keywordsSilver
    keywordsSolders
    keywordsReliability
    keywordsEpoxy adhesives
    keywordsLight-emitting diodes
    keywordsThermal conductivity
    keywordsBonding
    keywordsPackaging AND Energy dissipation
    treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003
    contenttypeFulltext
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