contributor author | Xin Li | |
contributor author | Xu Chen | |
contributor author | Guo-Quan Lu | |
date accessioned | 2017-05-09T00:37:13Z | |
date available | 2017-05-09T00:37:13Z | |
date copyright | September, 2010 | |
date issued | 2010 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26306#031011_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/142953 | |
description abstract | As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials | |
type | Journal Paper | |
journal volume | 132 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4002299 | |
journal fristpage | 31011 | |
identifier eissn | 1043-7398 | |
keywords | Heat | |
keywords | Temperature | |
keywords | Silver | |
keywords | Solders | |
keywords | Reliability | |
keywords | Epoxy adhesives | |
keywords | Light-emitting diodes | |
keywords | Thermal conductivity | |
keywords | Bonding | |
keywords | Packaging AND Energy dissipation | |
tree | Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003 | |
contenttype | Fulltext | |